1003-353X
2004 Issue 11
..............page:78-80
..............page:74
..............page:75-77
..............page:72-73
..............page:70-71
..............page:68-69
A CMOS High Linearity Variable Gain Amplifier
wang zi qiang ; wang zhi hua
wang zi qiang ; wang zhi hua
..............page:65-67,60
Design of Band-gap Voltage Reference Source of the Ballast
controller
yu you ling ; xu wei sheng ; wu qi di
yu you ling ; xu wei sheng ; wu qi di
..............page:61-64
A Fuzzy Logic Control Temperature Control System Based on MCU
chen zhi jian ; zheng xue ren ; huang ming wen ; li xu
chen zhi jian ; zheng xue ren ; huang ming wen ; li xu
..............page:57-60
Application of Working Procedure Ability Estimation to Fail-tests
du ying ; kang ya jun
du ying ; kang ya jun
..............page:29-31,48
gui pian qiao qu dui guang ke tiao kuan jun yun xing de fen xi
song kuang bao ; zhang wen hong ; zhao ya dong ; fan jie
song kuang bao ; zhang wen hong ; zhao ya dong ; fan jie
..............page:26-28
Comparison of Characteristics of Photoresists in Photoithography Process on Micromachining
lai wu xing ; xuan jian ping ; shi tie lin ; yang shu zi
lai wu xing ; xuan jian ping ; shi tie lin ; yang shu zi
..............page:22-25
Reactive Ion Etching of Al-Si Alloy:Select Etching Parameters
li xi you ; zhou wei ; zhang wei ; zhong tao ; liu zhi hong
li xi you ; zhou wei ; zhang wei ; zhong tao ; liu zhi hong
..............page:19-21
..............page:17-18
Research of DFT for Board Level BS Chain Based on Boundary Scan Technology
liu ming yun ; li gui xiang ; zhang xian zhi ; yang jiang ping
liu ming yun ; li gui xiang ; zhang xian zhi ; yang jiang ping
..............page:12-16
Fabrication and Testing of the MEMS High Temperature Capacitive Pressure Micro-sensor
xu ken ; wang shao qing ; feng yong jian
xu ken ; wang shao qing ; feng yong jian
..............page:8-11
Wafer Level Reliability Test
zhao yi ; xu xiang ming
zhao yi ; xu xiang ming
..............page:5-7,28
Low Power and Fast Test for SOC
chen xin wu ; chen chao yang
chen xin wu ; chen chao yang
..............page:1-4,11
..............page:插1-插4
Applications of New-Type Ultralow Power Single Microcontroller MSP430FE42X Seriesfor Single-Phase Ammeter
he xun lai ; li shi yi ; li hui jie
he xun lai ; li shi yi ; li hui jie
..............page:53-56
shu zi shi pin jie kou zhong de gao dai kuan shu ma nei rong bao hu ji shu tan tao
wu shu wei ; liu yuan cheng ; peng ji hu ; liu zuo
wu shu wei ; liu yuan cheng ; peng ji hu ; liu zuo
..............page:49-52
Wafer Bonding Used for Laser
niu jian ; chen guo ying ; hua ji zhen ; zhao wei qing
niu jian ; chen guo ying ; hua ji zhen ; zhao wei qing
..............page:45-48
Parameters Extraction of SiGe HBTs and the Simulation of Its Performances
yang wei ming ; chen jian xin ; zou de shu ; shi chen ; li zhen guo ; gao ming jie
yang wei ming ; chen jian xin ; zou de shu ; shi chen ; li zhen guo ; gao ming jie
..............page:41-44
Solid-Phase Reaction Between Co, Ni/n-poly-Si0.84Ge0.16 and Schottky Barrier Properties of the Formed Contacts
wang guang wei ; ru guo ping ; qu xin ping ; li bing zong
wang guang wei ; ru guo ping ; qu xin ping ; li bing zong
..............page:36-40
Reasons and Influencing Factors of Bend Fatigue Fracture for Leads
liu fei hua ; leng wen bo ; shen zhuo shen
liu fei hua ; leng wen bo ; shen zhuo shen
..............page:32-35,48