1003-353X
2005 Issue 11
..............page:4-8
High-Speed and High-Precision Image Recognition Algorithms of SMD-IC and Realizations
HU Yue-ming;QI Qi-feng;HAN Jia;YUAN Peng;WU Xin-sheng
HU Yue-ming;QI Qi-feng;HAN Jia;YUAN Peng;WU Xin-sheng
..............page:22-25,38
System-in-Package of RF System
CHEN Guo-hui;ZHENG Xue-ren;LIU Han-hua;FAN Jian-min;CHEN Ling-jing
CHEN Guo-hui;ZHENG Xue-ren;LIU Han-hua;FAN Jian-min;CHEN Ling-jing
..............page:17-21
Chip Stress Analysis and Structure Optimization in Stacked Multi-Chip Package
LIU Biao;WANG Ming-xiang;LIN Tian-hui
LIU Biao;WANG Ming-xiang;LIN Tian-hui
..............page:11-16
..............page:9-10
Recent Development of Optical Fiber Amplifier
FAN Guo-li;ZHAO Shang-hong;ZHOU Wan-yin
FAN Guo-li;ZHAO Shang-hong;ZHOU Wan-yin
..............page:1-3,16
..............page:78-80
..............page:75-77
..............page:73-74
..............page:71-72
fei si ka er tui chu shou chuang de mpc5200b chu li qi
fei si ka er ban dao ti ( zhong guo ) you xian gong si
fei si ka er ban dao ti ( zhong guo ) you xian gong si
..............page:68-70
A Wireless Multimedia Terminal Design Based on a Dual-Core Processor
YUAN Bing-bing;WANG Xuan;LU Jian-hua
YUAN Bing-bing;WANG Xuan;LU Jian-hua
..............page:64-67
Current Summing Mode CMOS Current Reference
LI Wei;CAI Min
LI Wei;CAI Min
..............page:60-63
TCAD Simulation and Optimization of High Gain and Small-Dimension Bipolar Transistor
XU Xin-xin;GUO Qi;HUO Lin;LI Hui-jun
XU Xin-xin;GUO Qi;HUO Lin;LI Hui-jun
..............page:57-59
Analysis for a New Low-Voltage Power MOSFET Structure
YAO Feng;HE Qi-xin;FANG Shao-hua
YAO Feng;HE Qi-xin;FANG Shao-hua
..............page:53-56
..............page:51-52,70
Research for Boundary-Scan Testing of Advanced Digital Networks
FANG Zi-cheng;YANG Jiang-ping;LI Gui-xiang;ZHANG Xian-zhi
FANG Zi-cheng;YANG Jiang-ping;LI Gui-xiang;ZHANG Xian-zhi
..............page:46-50
Application of Making Resistance Measurements Technology Using Kelvin 4-Wire Method
ZHAO Ying-wei;PANG Ke-jian
ZHAO Ying-wei;PANG Ke-jian
..............page:43-45,50
Optimizing of Preventive Maintenance Scheduling for Cluster Tools of Semiconductor Manufacturing
LI Hong;Qian Xing-san
LI Hong;Qian Xing-san
..............page:39-42
Applications of Chemical Vapor Deposition in the Back-End Process of Integrated Circuits Manufacturing
YI Wan-bing;TU Ri-neng;CHANG Bing-yi;WU Jin;MAO Du-li;ZOU Shi-chang
YI Wan-bing;TU Ri-neng;CHANG Bing-yi;WU Jin;MAO Du-li;ZOU Shi-chang
..............page:35-38
..............page:31-34
Hybrid Approach for Improving the Reliability of Die Bonding Process
FU Jun-qing;LI Han-xiong;HAN Lei
FU Jun-qing;LI Han-xiong;HAN Lei
..............page:26-30