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Semiconductor Technology
1003-353X
2005 Issue 7
Research of Epoxy Moulding Compound in Property and Use
LI Li-xin
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page:43-46
chan pin bo lan
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page:83-84
ye jie dong tai
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page:80-82
ban dao ti shi chang
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page:79
zong he xin wen
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page:77-78
xin wen dian ping
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page:74-76
li yong dan xin pian mcu ti gao zhao ming xi tong neng yuan xiao lv
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page:71-73
A Classic Wide Band Operational Amplifier Design and Analysis on the Stability of Constant-gm Circuit
WEI Ru-xin;Wei Fu-li;LI Zhao-Ji
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page:66-70
The Design and Test of 1.5GHz CMOS ECL Receiver
LIAO Bin;REN Huai-long;WU Hong-jiang;CHEN Xing
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page:63-65
A 10Gb/s SiGe Limiting Amplifier for Optical Receiver
HUANG Hai-yun;XU Yue;LIU Hua-zhu;LIU Jun;SUN Ling-ling
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page:60-62
Electron Beam Evaporation Deposited ZAO Thin Films by Orthogonal Experiment
GUO Ai-yun;XUE Yi-yu;XIA Zhi-lin;ZHU Xuan-min;GE Chun-qiao
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page:56-59
The 2DEG Induced by Polarization and Current Collapse in GaN-Based HFET
ZHANG Zhi-guo;YANG Rui-xia;LI Li;LI Xian-jie;WANG Yong;YANG Ke-wu
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page:50-55
Stability Controlling of Steam Content in Sealed IC
WANG Lin
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page:47-49
Effects of Resists Diffusion Length on the 0.13μm Process Window
WU Qiang
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page:39-42,59
Technical Study of AZ4620 Thick Photoresist for Micro Fabrication
LUO Bo-liang;DU Jing-lei;TANG Xiong-gui;DU Chun-lei;LIU SHI-JIE;GUO Yong-Kang
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page:34-38
Study of High Accuracy Monitor System Based on Infrared Electronic
CHEN Yu
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page:30-33
Developing of the Video Characteristic Impedance Device
LI Su-ping;ZHANG Xiao
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page:28-29,38
A New Device on Real-Time Measuring Thin Film Properties
HU Zhi-min;LIN Xiao-chun;AN Yu-ying
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page:25-27,33
The SIMS Measurement of Zn Concentration Distribution Induced by Laser
ZHANG Xue-qin;WU Yun-feng;YE Yu-tang;JIAO Shi-Long
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page:21-24
Scanning Infrared Microscopy Investigation of Defects and Precipitates in Crystalline Silicon
XI Zhen-qiang
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page:18-20
jie du da vinctm
chen liang
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page:16-17
Application, Emulation and Development Trend of Grating Light Valve
LI Jun;CHEN Hai-qing;YU Hong-bin;WANG Zhong
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page:11-15
Research Advances and Applications in Wafer Bonding Technology
WANG Hui;SHEN Guang-di;GAO Guo;LIANG Ting
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page:6-10
wo guo ic chan ye fa zhan dui ce shi ye de yao qiu
Suki
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page:4-5
Promoting the Growth of IC Designing Industry of China on Venture Capital
LIU JIAN-XIANG
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page:1-3,15