1003-353X
2006 Issue 10
..............page:737
..............page:800-801
..............page:798-799
..............page:796-797
yi dong duo mei ti zhong duan (mmp) zhuan wei hui quan li da zao duo yuan hua fu wu ping tai
yu long
yu long
..............page:795
..............page:794
su zhou gui gu tian tang yun ju ban dao ti jing cui ic china yu chang shang gong mou chun tian
Peter Wu
Peter Wu
..............page:792-793
ying jie yi dong duo mei ti ying yong gao qing shi pin de tiao zhan
fei si ka er ban dao ti ( zhong guo ) you xian gong si
fei si ka er ban dao ti ( zhong guo ) you xian gong si
..............page:790-791,793
Vacuum Evaporation and Film Properties of Mg/Ag Cathodes in Organic Light-Emitting Display(OLED)
LIU Qian;ZhANG Fang-hui;LI Ya-li
LIU Qian;ZhANG Fang-hui;LI Ya-li
..............page:743-746
Effect of Advanced Process on the Total Dose Irradiation of MOS Device
LIU Yuan;EN Yun-fei;LI Bin;SHI Qian;HE Yu-juan
LIU Yuan;EN Yun-fei;LI Bin;SHI Qian;HE Yu-juan
..............page:738-742,746
Optical and Electrical Characteristics of Al Doped Zinc Oxide Thin Films Prepared by Sol-Gel
LI Shi-ping;LI Ling
LI Shi-ping;LI Ling
..............page:733-737
Effect of Wafer Bow on Wafer Direct Bonding
MA Zi-wen;LIAO Guang-lan;SHI Tie-lin;TANG Zi-rong;NIE Lei;LIN Xiao-hui
MA Zi-wen;LIAO Guang-lan;SHI Tie-lin;TANG Zi-rong;NIE Lei;LIN Xiao-hui
..............page:729-732
Principle and Model of "Buffering and Slow-Down" for High-Speed Transient Pulse Sampling
CHEN Yu-xiao;YANG Mo-hua;TANG Dan;YIN Xian-dong
CHEN Yu-xiao;YANG Mo-hua;TANG Dan;YIN Xian-dong
..............page:787-789
Analysis and Design of Field Plates of High Voltage LDMOS
LIU Lei;GAO Shan;CHEN Jun-ning;KE Dao-ming;LIU Qi;ZHOU Bang-yan
LIU Lei;GAO Shan;CHEN Jun-ning;KE Dao-ming;LIU Qi;ZHOU Bang-yan
..............page:782-786
Study of AlN Insulated Film for High Temperature Pressure Sensor
LI Hui;SUN Yi-cai;PAN Guo-feng;QIU Mei-yan
LI Hui;SUN Yi-cai;PAN Guo-feng;QIU Mei-yan
..............page:778-781
Design and Fabrication of GaAs Mixer Diodes
HAN Jun;LIN Shun-bing
HAN Jun;LIN Shun-bing
..............page:774-777
Analysis of High Voltage LDMOS Power Dissipation
WU Xiu-long;CHEN Jun-ning;KE Dao-ming;MENG Jian
WU Xiu-long;CHEN Jun-ning;KE Dao-ming;MENG Jian
..............page:770-773,786
Silicon Vertical Interconnect Technology of Low Cost
FENG Guo-qiang;CAI Jian;WANG Shui-di;JIA Song-liang
FENG Guo-qiang;CAI Jian;WANG Shui-di;JIA Song-liang
..............page:766-769,781
Microwave Device Modeling Based on the Fuzzy Neural Network
XIANG Bing;CHENG Qiang;WEI Yan-hua;YANG Yi
XIANG Bing;CHENG Qiang;WEI Yan-hua;YANG Yi
..............page:762-765
The Improvement of Wafer Surface Condition and Polishing Slurry in the Process of Wafer Polishing
ZHANG Wei;ZHOU Jian-wei;LIU Yu-ling;LIU Cheng-lin
ZHANG Wei;ZHOU Jian-wei;LIU Yu-ling;LIU Cheng-lin
..............page:758-761,765
..............page:756-757
..............page:754-755
Anodic Oxidation Nano-Fabrication at Different Parameters by AFM
SUN Zhi;QIN Shui-jie
SUN Zhi;QIN Shui-jie
..............page:751-753,757
Effect of Technical Parameter on the Conductivity of TiO2-Ag Agglomeration
WANG Yu-dan;LIU Jian-hong;ZHANG Tao;LIN Feng
WANG Yu-dan;LIU Jian-hong;ZHANG Tao;LIN Feng
..............page:747-750,725
..............page:726-728,737
Novel Environment Protection and Clean Technologies for Wafer
CHENG Li;LI Jia-yuan;LI Lan;LI Hua-le;WANG Zhen-yu
CHENG Li;LI Jia-yuan;LI Lan;LI Hua-le;WANG Zhen-yu
..............page:721-725