1003-353X
2006 Issue 11
..............page:873-877
..............page:871-872
rang dian shi jie mu cong qi ju shi jin ru ni de kou dai dvb-h biao zhun shi chang ji qi jie jue fang an de ying yong
fei si ka er ban dao ti ( zhong guo ) you xian gong si
fei si ka er ban dao ti ( zhong guo ) you xian gong si
..............page:868-870
fei si ka er zhen dui xia yi dai ying yong gan zhi wang luo de powerquicctm chu li qi jia gou gao du ji cheng duo he mpc8572 xi lie da fu tui dong wang luo yan jin
fei si ka er ban dao ti ( zhong guo ) you xian gong si
fei si ka er ban dao ti ( zhong guo ) you xian gong si
..............page:866-867
Design and Application of DC/AC Differential Signal Source Converter
NING Min-dong;LI Tian-chao;XIONG Zhong-chao;FU He-ping;JIA Guo-hua
NING Min-dong;LI Tian-chao;XIONG Zhong-chao;FU He-ping;JIA Guo-hua
..............page:862-865
Low Noise Rail-to-Rail Input and Output Range Operational Amplifier
XING Li-dong;CAI Min
XING Li-dong;CAI Min
..............page:859-861,870
Investigation on Surface Trapping Effects of GaN-Based HEMT
LUO Qian;DU Jiang-feng;LUO Da-wei;ZHU Lei;LONG Fei;JIN Chong;ZHOU Wei;YANG Mo-hua
LUO Qian;DU Jiang-feng;LUO Da-wei;ZHU Lei;LONG Fei;JIN Chong;ZHOU Wei;YANG Mo-hua
..............page:856-858,867
Analysis on the Characters of SAGM Single-Photon Detectors in Quantum Communication
PENG Jian;FENG Xue-dong;YANG Bo-jun;YU Li
PENG Jian;FENG Xue-dong;YANG Bo-jun;YU Li
..............page:851-855
Preparation of Φ 60 mm Te-Doped GaP Single Crystal
Lin Quan;Xu Xiao-lin;Jin Pan
Lin Quan;Xu Xiao-lin;Jin Pan
..............page:847-850
Thermal Analysis of High Power Semiconductor Laser Arrays
LI Dong-mei;AN Zhen-feng;WANG Xiao-yan;XU Min;CHEN Guo-ying
LI Dong-mei;AN Zhen-feng;WANG Xiao-yan;XU Min;CHEN Guo-ying
..............page:843-846
New Multilayer Copper Interconnect Technologies for VLSI
CHENG Li;LI Jia-yuan;LI Hua-le;LI Lan;WANG Zhen-yu
CHENG Li;LI Jia-yuan;LI Hua-le;LI Lan;WANG Zhen-yu
..............page:839-842
Design of a 10-bit 100 MHz Pipelined ADC Using 0.25 μ m CMOS Process
JIANG Shen-fei;DAI Qing-yuan;ZHU Hong-wei;CHEN Mei-na;WANG Dong-hui
JIANG Shen-fei;DAI Qing-yuan;ZHU Hong-wei;CHEN Mei-na;WANG Dong-hui
..............page:835-838
..............page:833
..............page:834
Analysis on the Effect of Wire Bonding Process Parameters on the Packaging Quality
LIU Chang-hong;GAO Jian;CHEN Xin;ZHENG De-tao
LIU Chang-hong;GAO Jian;CHEN Xin;ZHENG De-tao
..............page:828-832
..............page:823-827
IR System for Detecting Wafer Bonding Quality
ZHOU Ping;LIAO Guang-lan;SHI Tie-lin;TANG Zi-rong;NIE Lei;LIN Xiao-hui
ZHOU Ping;LIAO Guang-lan;SHI Tie-lin;TANG Zi-rong;NIE Lei;LIN Xiao-hui
..............page:819-822,827
Recent Development of Lead-Free Solder in Electronic Packaging
HUANG Zhuo;ZHANG Li-ping;CHEN Qun-xing;TIAN Min-bo
HUANG Zhuo;ZHANG Li-ping;CHEN Qun-xing;TIAN Min-bo
..............page:815-818
Petrinet-Based Modeling for Foundry Manufacturing System
SHAO Zhi-fang;QIAN Xing-san;LIU Zhong-ying
SHAO Zhi-fang;QIAN Xing-san;LIU Zhong-ying
..............page:810-814
History and Perspective of MOSFET (Ⅰ)
XIAO De-yuan;XIA Qing;CHEN Guo-qing
XIAO De-yuan;XIA Qing;CHEN Guo-qing
..............page:805-809,827
Overview of Radio Frequency Identification Technology
YUAN Yuan;JIANG Yan-feng
YUAN Yuan;JIANG Yan-feng
..............page:801-804