Semiconductor Technology 2006 Issue 12 ji cheng dian lu qun " xin " shan yao zhang jiang ge lu jing ying miao lun chan ye fa zhan

Journals A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Semiconductor Technology
1003-353X
2006 Issue 12

..............page:955-956

Compare of Scattering Mechanisms in SI GaAs Photoconductive Switch
HOU Jun-yan;DAI Hui-ying;SHI Wei;DONG Qiu-Xia

..............page:944-947

..............page:938-943

Low-Power Bitline Architecture in SRAM
GAO Ning;SHI Liang;HOU Wei-hua;YU Zong-guang

..............page:935-937,950

Study on the Properties of FRD by Spin-on Platinum Diffusion
SUN Shu-mei;ZENG Xiang-bin;YUAN De-cheng;JIANG Lu-jin;XIAO min;FENG Ya-ning

..............page:930-934

Study on the Developing of TPS for Digital PCB with RAM Chips
CHENG Ben-mao;JU Yan-qiu;WANG Hong;YANG Shi-yuan

..............page:926-929,934

..............page:924-925,934

Litho-Rule Checking Insertion into DFM Flow
LU Mei-jun;JIN Xiao-liang;MAO Zhi-biao;LIANG Qiang

..............page:920-923

Forming Secret of the Race Hazard Based on Experiment Method
NING Min-dong;XIONG Zhong-chao;LI Tian-chao;FU He-ping;ZHANG Shuan-ji

..............page:915-919

Study on InSb Semiconductor Material for Polishing Slurry
LIU Cheng-lin;LIU Yu-ling;ZHANG Wei;WU Xiao-ling;JIA Ying-qian

..............page:912-914

..............page:908-911

an sen mei dui led de kan fa !
hu ping sheng

..............page:906-907

..............page:904-905,911

Package Materials and Processes of MEMS Devices
YAN Xue-ping;CHENG Li;HAN Qing-fu;ZHANG Hui;LI Jun;LIU De-lin;XU Zhi-chun

..............page:900-903,919

Au-Si Eutectic Bonding Technology for MEMS Device
LIU Bing-wu;ZHANG Zhao-hua;TAN Zhi-min;LIN Hui-wang;LIU Li-tian

..............page:896-899

..............page:892-895,899

Developing Status and Analysis of RF/Microwave Transistors
NAN Jing-chang;LI Shu-lan;LIU Yuan-an;TANG Bi-hua

..............page:887-891

..............page:881-886,891