1003-353X
2006 Issue 2
Study of Transparent Conducing ZnO : Ga Films Deposited on Polyimide Substrate by RF Magnetron Sputtering
LI Su-min;ZHAO Yu-tao;HE Wei-feng;DAI Qi-xun;ZHANG Zhao
LI Su-min;ZHAO Yu-tao;HE Wei-feng;DAI Qi-xun;ZHANG Zhao
..............page:94-97
Preparation and Characterization of Fluorinated Amorphous Carbon(a-C :F)
SU Xiang-lin;WU Zhen-yu;JIANG Yu;WANG Jia-you;YANG Yin-tang
SU Xiang-lin;WU Zhen-yu;JIANG Yu;WANG Jia-you;YANG Yin-tang
..............page:90-93
..............page:88-89,97
kuo san he qing xi de fa zhan fang xiang -- guo chan ban dao ti she bei tan tao
sheng jin long ; liu xiao zuo
sheng jin long ; liu xiao zuo
..............page:86-87
..............page:81-85,87
Study of GaN-Based Semiconductor Material and Device Grown on Si Substrate
TENG Xiao-yun;LIU Cai-chi;HAO Qiu-yan;ZHAO Li-wei;ZHANG Wei
TENG Xiao-yun;LIU Cai-chi;HAO Qiu-yan;ZHAO Li-wei;ZHANG Wei
..............page:98-101,107
Influence of Nano-Titania Additive on the Property of TiO2 Varistor Ceramics
CHEN Hai-fang;GAN Guo-you;YAN Ji-kang;ZHANG Xiao-wen
CHEN Hai-fang;GAN Guo-you;YAN Ji-kang;ZHANG Xiao-wen
..............page:102-104,118
Study of InGaAs/GaAs Quantum Wells by X-Ray Double Crystal Diffraction
YANG Yan;XUE Chen-yang;ZHANG Bin-zhen;ZHANG Wen-dong
YANG Yan;XUE Chen-yang;ZHANG Bin-zhen;ZHANG Wen-dong
..............page:105-107
HF/O3 Application in 300mm Wafer Cleaning
YAN Zhi-rui;LI Jun-feng;LIU Hong-yan;ZHANG Jing;LI Li
YAN Zhi-rui;LI Jun-feng;LIU Hong-yan;ZHANG Jing;LI Li
..............page:108-111
Chemical Effect Mechanism in Chemical Mechanical Polishing for Silicon Wafer
CHEN Zhi-gang;CHEN Yang;CHEN Ai-lian
CHEN Zhi-gang;CHEN Yang;CHEN Ai-lian
..............page:112-114,126
Analysis of Plasma Etching Controlling Model
WANG Wei;YE Tian-chun;WU Zhi-gang;TIAN Yi-xiang
WANG Wei;YE Tian-chun;WU Zhi-gang;TIAN Yi-xiang
..............page:115-118
Compensating the Error in Z Axis in the Process of Die Bonding
DENG Gui-ling;CUI Hui-xi;GENG Fei
DENG Gui-ling;CUI Hui-xi;GENG Fei
..............page:119-121
Rapid Evaluation Method of Activation Energy for Semiconductor Device
GUO Chun-sheng;XIE Xue-song;MA Wei-dong;LI Zhi-guo;CHENG Yao-hai
GUO Chun-sheng;XIE Xue-song;MA Wei-dong;LI Zhi-guo;CHENG Yao-hai
..............page:122-126
Unified Analog-Digital Test Technology for Mixed-Signal System
CHENG Li;LI Jia-yuan;WANG Zhen-yu;LI Hua-le;HE Xing
CHENG Li;LI Jia-yuan;WANG Zhen-yu;LI Hua-le;HE Xing
..............page:127-131,134
Study on the Technique about Thermal Resistance and Burn-in of Transistor Arrays
CAO Yao-long;YU Xue-dong;XU Li-sheng
CAO Yao-long;YU Xue-dong;XU Li-sheng
..............page:132-134
Research on Boosting of Quality Control of Electronic Parts of Apparatus for Military Use
ZHAO He-yi
ZHAO He-yi
..............page:135-138
Study for Thermal Analysis Technology of Three-Dimension SRAM Component
CAO Yu-sheng;LIU Jun;SHI Fa-zhong
CAO Yu-sheng;LIU Jun;SHI Fa-zhong
..............page:139-142,154
bu duan zhuang da de wu xian tong xin shi chang tiao zhan wu xian ce shi ji shu
ke li deng xi tong you xian gong si
ke li deng xi tong you xian gong si
..............page:143-145
..............page:146-148,138
Control Circuit for High Voltage Transfer in IC Design
YANG Qing-sen;ZHOU Xiao-fang
YANG Qing-sen;ZHOU Xiao-fang
..............page:149-151
Design of Ku Band Incorporate Five Frequency Multipliers
GUO Bin;LI Feng;GUO Yong-ming
GUO Bin;LI Feng;GUO Yong-ming
..............page:152-154
..............page:155-163