1003-353X
2006 Issue 4
Application and Process of Integrated Passive Element in Wireless System
SUN Fang-kui;JIANG Wei;ZHAO Hui;ZHANG Shou-tao
SUN Fang-kui;JIANG Wei;ZHAO Hui;ZHANG Shou-tao
..............page:241-244
Analysis on the Competitive Advantage of Semiconductor Foundry in China
ZHANG Rui;QIAN Xing-san
ZHANG Rui;QIAN Xing-san
..............page:245-249,267
Application of CF4 Plasma Activation in Low Temperature Silicon Direct Bonding
HUO Wen-xiao;Xu Chen;YANG Dao-hong;ZHAO Lin-lin;ZHAO Hui;SHEN Guang-di
HUO Wen-xiao;Xu Chen;YANG Dao-hong;ZHAO Lin-lin;ZHAO Hui;SHEN Guang-di
..............page:250-252,263
..............page:335-337
..............page:331-334
..............page:330
..............page:327-329
..............page:325-326
..............page:321-324
fei si ka er cmos kuan dai gui diao xie qi jian hua ji ding he she ji -- zhu chang shang geng kuai jin ru jia ting yu le shi chang
fei si ka er ban dao ti ( zhong guo ) you xian gong si
fei si ka er ban dao ti ( zhong guo ) you xian gong si
..............page:319-320
Low-Voltage and Low-Consumption BiCMOS Cascode Charge Amplifer
ZHU Yi-yun;CHENG Li;ZHU Jun;LI Lan;WANG Zhen-yu
ZHU Yi-yun;CHENG Li;ZHU Jun;LI Lan;WANG Zhen-yu
..............page:315-318,286
Accurate IP Behavioral Modeling of Phase Lock Loop
MA Zhe;CAI Min
MA Zhe;CAI Min
..............page:310-314
SystemC-Based NoC Simulation Framework Supporting Heterogeneous Communicator
XU Ning-yi;LENG Xiang-lun;ZHOU Zu-cheng
XU Ning-yi;LENG Xiang-lun;ZHOU Zu-cheng
..............page:305-309
TE-Module-Based "Uninterruptible Power Supply"
LIU Zhi-Hua
LIU Zhi-Hua
..............page:303-304,314
Efficient Field Emission from Porous Silicon
SUN Jian-gang
SUN Jian-gang
..............page:300-302,309
Implementation of Continuous Wavelet Transform Using Switched-Current Circuit
ZHAO Wen-shan;HE Yi-gang;YAN Jin-xi;LI Bian
ZHAO Wen-shan;HE Yi-gang;YAN Jin-xi;LI Bian
..............page:295-299
Si-Si Wafer Bonding with Glass Intermediate Layer
NIE lei;SHI tie-lin;LIAO guang-lan;ZHONG Fei
NIE lei;SHI tie-lin;LIAO guang-lan;ZHONG Fei
..............page:269-271,294
..............page:268
..............page:266-267
chuang xin ke kao , ying de shi chang -- zhuan fang shen yang xin yuan gong si zong jing li zong run fu
hu ping sheng
hu ping sheng
..............page:264-265
Embedded Memory Fault Repair Strategies Based on SOC
CHEN Guo-bin
CHEN Guo-bin
..............page:260-263
Investigation on the Nature of Flow Pattern Defects in CZ- Si Crystals
QIAO Zhi;LIU Cai-chi;ZHANG Yan-li;SHI Yan
QIAO Zhi;LIU Cai-chi;ZHANG Yan-li;SHI Yan
..............page:257-259
Study on the CMP Property of GaAs Wafer Using Nano Cerium Dioxide Abrasive
CHEN Yang;LI Xia-zhang;CHEN Zhi-gang
CHEN Yang;LI Xia-zhang;CHEN Zhi-gang
..............page:253-256,267
High Isolation MEMS Double Membranes Switches for Broadband Application
CAI Jie;LIAO Xiao-ping;ZHU Jian
CAI Jie;LIAO Xiao-ping;ZHU Jian
..............page:290-294
A High Speed Fully Differential CMOS Op-Amp
ZHU Xiao-zhen;ZHU Zhang-ming;CHAI Chang-chun
ZHU Xiao-zhen;ZHU Zhang-ming;CHAI Chang-chun
..............page:287-289,299
ic ce shi yuan li
xu wei da
xu wei da
..............page:284-286
The Application of Measuring and Testing Techniques for Operational Amplifiers and Voltage Comparators
WANG Guang-wu
WANG Guang-wu
..............page:280-283
..............page:276-279
Method and Control of Chip Joinning for Semiconductot Device
PAN Ru;LI Ming-Juan;WU Jian;LIU Ying-Kun
PAN Ru;LI Ming-Juan;WU Jian;LIU Ying-Kun
..............page:272-275,279