1003-353X
2006 Issue 5
New Frequency Synthesis Technology with Fast Lock Time and Low Phase Noise
WEI Fu-li;ZHANG Hua-peng
WEI Fu-li;ZHANG Hua-peng
..............page:321-324,333
..............page:400-402
..............page:397-399
..............page:396
..............page:393-395
..............page:392
fei si ka er kuo zhan mems1-2-3 zhou chuan gan qi man zu xiao fei dian zi shi chang
fei si ka er ban dao ti ( zhong guo ) you xian gong si
fei si ka er ban dao ti ( zhong guo ) you xian gong si
..............page:390-391
Online Power Monitor Based on the 80C196 SCM
FANG Xiang-qian;HE Huan-lin
FANG Xiang-qian;HE Huan-lin
..............page:387-389
Study on the High Speed Multi Signal Control MCM
ZHANG Ya-jin;GUO Fang;WANG Hai
ZHANG Ya-jin;GUO Fang;WANG Hai
..............page:385-386,389
Microwave Ultra-Low Phase Noise Optical-Electronic Oscillator
TANG Wei;ZHU Xin-gang
TANG Wei;ZHU Xin-gang
..............page:382-384
Thin Film Bulk Acoustic Resonators and Applications
CHI Zhi-peng;ZHAO Zheng-ping;Lv Miao;YANG Rui-xia
CHI Zhi-peng;ZHAO Zheng-ping;Lv Miao;YANG Rui-xia
..............page:377-381
Design Essential of C Band Low Noise Amplifier
ZHAO Xian-chao;DONG Wei-hua
ZHAO Xian-chao;DONG Wei-hua
..............page:374-376,381
Research on the Design of Evolvable TMR Voting Circuit
WU Hui-cong;LIU Shang-he;ZHAO Qiang;YUAN Liang
WU Hui-cong;LIU Shang-he;ZHAO Qiang;YUAN Liang
..............page:370-373
Design for an IC Based on RSA Encryption Algorithm
ZHONG Tian-bin;CAI Min;SHI Wei-wei
ZHONG Tian-bin;CAI Min;SHI Wei-wei
..............page:367-369,373
Effects of Dispersing Agents on Dispersion Behavior of Nano-Titania Powders
SUN Xiu-guo;Zhang Jian-min
SUN Xiu-guo;Zhang Jian-min
..............page:363-366
Study of Ta CMP and Polishing Mechanism
WANG Juan;LIU Yu-ling;ZHANG Jian-xin;SHU Xing-jun
WANG Juan;LIU Yu-ling;ZHANG Jian-xin;SHU Xing-jun
..............page:361-362,366
Study of X-Ray Total Effect in SOI MOSFET
HE Yujuan;SHI Qian;LI Bin;LIN Li;ZHANG Zheng-xuan
HE Yujuan;SHI Qian;LI Bin;LIN Li;ZHANG Zheng-xuan
..............page:357-360
SOC Oriented Substrate Noise Macromodel
WU Xiao-peng;YANG Yin-tang;ZHU Zhang-ming
WU Xiao-peng;YANG Yin-tang;ZHU Zhang-ming
..............page:353-356,360
..............page:350-352,349
Study of the Methods for Constant Acceleration Test
ZHANG Guo-hua;DU Ying
ZHANG Guo-hua;DU Ying
..............page:346-349
Low Temperature Deposition of Poly-Silicon Thin Films by ECR-PECVD
FENG Qing-hao;QIN Fu-wen;WU Ai-min;WANG Yang
FENG Qing-hao;QIN Fu-wen;WU Ai-min;WANG Yang
..............page:342-345
ban dao ti pvd gong yi yong jian she ba cai dan sheng de gu shi -- yu yao " zao ba " zha ji
peter wu; hu ping sheng
peter wu; hu ping sheng
..............page:340-341
Investigation on the Wettability of Sn-Cu Lead-Free Solder in Electronic Packaging
GU Xiao-yan;QU Wen-qing;ZHAO Hai-yun;ZHUANG Hong-shou
GU Xiao-yan;QU Wen-qing;ZHAO Hai-yun;ZHUANG Hong-shou
..............page:337-339,349
Technology and Slurry of Barrier CMP in ULSI with Cu Interconnection
LI Wei-wei;TAN Bai-mei;ZHOU Jian-wei;LIU Yu-ling
LI Wei-wei;TAN Bai-mei;ZHOU Jian-wei;LIU Yu-ling
..............page:334-336,345
Research on the Properties of Copper Pulse Plating Layer in IC Interconnect
ZENG Lei;XU Sai-sheng;ZHANG Li-feng;ZHANG Wei;ZHANG Wei;WANG Li-kang
ZENG Lei;XU Sai-sheng;ZHANG Li-feng;ZHANG Wei;ZHANG Wei;WANG Li-kang
..............page:329-333
Study on the Shear Testing of Sn-Ag-Cu Solder Joint in Microelectronic Packaging
GU Bo;WANG Jun;TANG Xing-yong;YU Hong-kun;XIAO Fei
GU Bo;WANG Jun;TANG Xing-yong;YU Hong-kun;XIAO Fei
..............page:325-328,333