1003-353X
2006 Issue 6
..............page:472
..............page:470-472
..............page:470
zhi li mo ni ji shu chuang xin man zu shi chang zeng chang xu qiu -- fei si ka er ban dao ti mo ni ji shu ji chan pin quan mian jie du
fei si ka er ban dao ti ( zhong guo ) you xian gong si
fei si ka er ban dao ti ( zhong guo ) you xian gong si
..............page:467-469
Study on the Composition Principle and the Design Scheme of Digital Television Set Top Box
MU Wei-xin;FANG Xiang-qian;HAN Jian-xun
MU Wei-xin;FANG Xiang-qian;HAN Jian-xun
..............page:463-466
Design of a 10Base-T Interface Amplifier
Chen ZhiWei;Cai Min
Chen ZhiWei;Cai Min
..............page:460-462,469
Digital MMIC Phase Shifter CAD
XIE Yuan-yuan;GAO Xue-bang;FANG Yuan;LIU Wen-jie;REN Huai-long
XIE Yuan-yuan;GAO Xue-bang;FANG Yuan;LIU Wen-jie;REN Huai-long
..............page:456-459
PLD-Based Realization of High Resolution Time-to-Digit Converter
WANG Fu-yuan;YANG Yu-ye;SHI Wei;WANG Wei
WANG Fu-yuan;YANG Yu-ye;SHI Wei;WANG Wei
..............page:452-455,466
Optical Structure Optimizing of Cavity Facet for High Power Semiconductor Lasers
ZHAO Run;GUO Fang;YANG Hong-wei;HUA Ji-zhen
ZHAO Run;GUO Fang;YANG Hong-wei;HUA Ji-zhen
..............page:448-451
Optimization of PSOI LDMOSFET Structure
CHENG Xin-hong;SONG Zhao-rui;YU Yue-hui;JIANG Li-juan;XU Zhong-de
CHENG Xin-hong;SONG Zhao-rui;YU Yue-hui;JIANG Li-juan;XU Zhong-de
..............page:444-447,459
Problems and Solutions in Logic Cluster Boundary Scan Test
WANG Ning;ZHANG Yang;WU Yi-feng
WANG Ning;ZHANG Yang;WU Yi-feng
..............page:441-443,451
Resistive Film as Damping Layer for the Resonant Modes of the MIC Package
ZHANG Bo-wen;TIAN Li-qing
ZHANG Bo-wen;TIAN Li-qing
..............page:437-440
Fatigue Life Assessment of Solder Joints of BGA Component in Board Level Drop Test
QU Xin;LOU Hao-huan;CHEN Zhao-yi;QI Bo;LEE Taekoo;WANG Jia-ji
QU Xin;LOU Hao-huan;CHEN Zhao-yi;QI Bo;LEE Taekoo;WANG Jia-ji
..............page:432-436
Research on a Method of Latch up Immunity in Power IC
SONG Hui-bin;TANG Chen;YI Yang-bo;SUN Wei-feng
SONG Hui-bin;TANG Chen;YI Yang-bo;SUN Wei-feng
..............page:429-431,440
Study on the Deposition of Copper onto Silicon Wafer Surface in HF Solution
ZHANG Xi-Hui;LIU Yu-Ling;LI jie
ZHANG Xi-Hui;LIU Yu-Ling;LI jie
..............page:425-428
..............page:423-424
Technologies and Applications of Electron Beam Exposure
WANG Zhen-yu;CHENG Li;ZHU Jun;LI Lan
WANG Zhen-yu;CHENG Li;ZHU Jun;LI Lan
..............page:418-422,428
Study of Reaction Ion Etching Processing Technique
LAI Wu-xing;LIAO Guang-lan;SHI Tie-lin;YANG Shu-zi
LAI Wu-xing;LIAO Guang-lan;SHI Tie-lin;YANG Shu-zi
..............page:414-417
New Development in Dry Etching of GaN
WANG Chong;HAO Yue;FENG Qian;GUO Liang-liang
WANG Chong;HAO Yue;FENG Qian;GUO Liang-liang
..............page:409-413
Extreme Ultraviolet Lithography Source
QIU Meng-tong;P.C hoi
QIU Meng-tong;P.C hoi
..............page:406-408,417
Summarize for the Investigation of the Field-Plate Structure in GaN-Based HEMT
MO Jiang-hui;CAI Shu-jun
MO Jiang-hui;CAI Shu-jun
..............page:401-405