1003-353X
2006 Issue 9
fei si ka er lv xian jiang mram ji shu tou ru shang yong
fei si ka er ban dao ti ( zhong guo ) you xian gong si
fei si ka er ban dao ti ( zhong guo ) you xian gong si
..............page:709-711
Design of 2.4 GHz CMOS Low Noise Amplifier
WANG Lin;XU Guo-dong
WANG Lin;XU Guo-dong
..............page:706-708,711
Study on the Meso-Piezoresistive Effect of Resonant Tunneling Film in GaAs Micro-Structure
WANG Jian;ZHANG Wen-dong;XUE Chen-yang;XIONG Ji-jun;ZHANG Bin-zhen
WANG Jian;ZHANG Wen-dong;XUE Chen-yang;XIONG Ji-jun;ZHANG Bin-zhen
..............page:702-705
Comparison of Accelerated Life Tests of Electronic Component
LIU Jing;LU Chang-zhi;LI Zhi-guo;GUO Chun-sheng;FENG Shi-wei
LIU Jing;LU Chang-zhi;LI Zhi-guo;GUO Chun-sheng;FENG Shi-wei
..............page:680-683
Study of Failure Mechanism and Evaluation Method for Plastic Encapsulated Microelectronics Devices
ZHANG Peng;CHEN Yi-yu
ZHANG Peng;CHEN Yi-yu
..............page:676-679
Off-Target Model-Based OPC
LU Mei-jun;JIN Xiao-liang;MAO Zhi-biao;LIANG Qiang
LU Mei-jun;JIN Xiao-liang;MAO Zhi-biao;LIANG Qiang
..............page:673-675,679
Analog Front-End for 13.56 MHz RFID Reader
LIU Dong-sheng;ZOU Xue-cheng;YANG Qiu-ping
LIU Dong-sheng;ZOU Xue-cheng;YANG Qiu-ping
..............page:669-672,679
..............page:667-668
checkpoint ji shu de bei jing
peter wu; hu ping sheng
peter wu; hu ping sheng
..............page:666,668
..............page:662-665
..............page:660-661
Development of Wafer Handling Cell Clean System
CONG Ming;DU Yu;SHEN Bao-hong
CONG Ming;DU Yu;SHEN Bao-hong
..............page:656-659
Application of Water Saving Technology in Semiconductor Factory
LI Xiao-hua;HE Yi-liang
LI Xiao-hua;HE Yi-liang
..............page:653-655
Post Hot Phosphoric Acid SiON/SiN Etching Defect Analysis and Solving Methods
XU Kuan;CHENG Xiu-lan
XU Kuan;CHENG Xiu-lan
..............page:650-652
Dynamic Release Rule for Multiple Re-Entrant Wafer Fabrication
GUO Yong-hui;SHAO Zhi-fang;QIAN Xing-san
GUO Yong-hui;SHAO Zhi-fang;QIAN Xing-san
..............page:645-649,665
Overview of BCD Process
CHEN Zhi-yong;HUANG Qi-yu;GONG Da-wei
CHEN Zhi-yong;HUANG Qi-yu;GONG Da-wei
..............page:641-644,659
High Rate-Deposition of Microcrystalline Silicon Films and Solar Cell
SUN Jian;YU Yuan-gao;WANG Rui;HOU Guo-fu;XUE Jun-ming;ZHAO Ying;GENG Xin-hua;LI Yi-gang
SUN Jian;YU Yuan-gao;WANG Rui;HOU Guo-fu;XUE Jun-ming;ZHAO Ying;GENG Xin-hua;LI Yi-gang
..............page:697-701
ke li deng xin tui chu de sapphire d-40 xi tong neng ti gong zhen zheng de ke sheng ji te xing he mo kuai hua jie gou
ke li deng xi tong you xian gong si
ke li deng xi tong you xian gong si
..............page:696
Advanced Stacked 3D Packaging Technology and Its Application Prospects
LU Jin;CHENG Li;WANG Zhen-yu;LI Lan;LI Jia-yuan;WANG Jian-min
LU Jin;CHENG Li;WANG Zhen-yu;LI Lan;LI Jia-yuan;WANG Jian-min
..............page:692-695
DFT Strategy of SOC Design
ZHOU Yu-liang;MA Qi
ZHOU Yu-liang;MA Qi
..............page:687-691
Fast Threshold Segmentation Algorithm for Surface Mounting Component Image Recognition
GAO Hong-xia;WANG Shan;LI Zheng-fang
GAO Hong-xia;WANG Shan;LI Zheng-fang
..............page:684-686,701