Semiconductor Technology 2007 Issue 11 ban dao ti ji shu zheng gao qi shi / ban dao ti ji shu gao yue

ban dao ti ji shu zheng gao qi shi / ban dao ti ji shu gao yue

..............page:1008,后插1

wei na dian zi ji shu di er jie li shi hui nian hui zai shang hai zhao kai / mei yan fa chu na mi tai yang neng dian chi cu xi jin wei tou fa liang wan fen zhi yi / zhong guo di yi jie wei na dian zi ji shu xing ye jiao liu da hui zai shang hai cheng gong zhao kai

..............page:928,943,956

zong he xin wen

..............page:1012

ye jie dong tai

..............page:1009-1012

jia qiang shi chang hua yun zuo tui jin chan ye hua fa zhan shi dai min xin gong si chuang ye yu fa zhan liang zhou nian
Victor

..............page:1009

fei si ka er tu po jia gou jie xian qe128 rang she ji geng jia ling huo
fei si ka er ban dao ti ( zhong guo ) you xian gong si

..............page:1007-1008

Design of a High PSRR Bandgap Voltage Reference
ZENG Jian-ping;ZOU Wei-hua;YI Feng;TIAN Tao

..............page:984-987

Design of Current Reference with Temperature Compensation for AC/DC Power Supply
YING Jian-hua;ZHANG Jiao-yang;FANG Chao

..............page:980-983

Analysis and Circuit Simulation of Boost Synchronous Rectifier Power MOSFET
ZHAO Wan-wan;FENG Quan-yuan

..............page:975-979

Design of CMOS CFOA with Low Voltage and Low Power
DU Guang-tao;CHEN Xiang-dong;LIANG Heng;WANG Hong-yan;PENG Jian-hua

..............page:970-974

Properties Analysis of Alkali Etching on Ge Wafer
L(U) Fei;LIU Chun-xiang;YANG Hong-xing;ZHAO Quan;YU Yan;ZHAO Xiu-ling

..............page:967-969

Research on Controlling Technology of VB GaAs Polished Wafer in Geometry Parameters
ZHAO Quan;YANG Hong-xing;LI Bao-jun;L(U) Fei;LIU Yu-ling

..............page:964-966

Si-Doped Cu-Compensated High-Resistance n-GaAs Single Crystal
WU Zhuang-wen;ZHENG An-sheng;YU Hong-guo;ZHAO Jing-min;YUAN Ze-hai;ZHANG Hai-tao

..............page:961-963,987

Analysis of Surface Characteristics of Polishing Pad
SU Jian-xiu;FU Yu;DU Jia-xi;CHEN Xi-qu;ZHANG Xue-liang;GUO Dong-ming

..............page:957-960

Analysis of Power MOSFET Performance in Parallel Operation
QIAN Min;XU Ming-qian;MI Zhi-nan

..............page:951-956

New Method of Grayscale Modulation for OLED Display
LI Hong-qin

..............page:948-950

Study of Bulk-Implanting TrenchMOS Model
GE Zhe;LI Hai-song;WANG Qin;SUN Wei-feng

..............page:944-947

Development of S-Band SiC MESFET with 10 W Output
PAN Hong-shu;LI Liang;CHEN Hao;QI Guo-hu;HUO Yu-zhu;YANG Fei;FENG Zhen;CAI Shu-jun

..............page:940-943

Optimizing Wet Clean Process for Restraining Pad Recrystallization Defect
QIAN Hong-tao;YANG Hong-chun

..............page:937-939

Influence of Bonding Line Thickness on Thermal Reliability of Power Device
ZHANG Lei;GUO Hao-wen;HE Lun-wen;WANG Li-kang;ZHANG Wei

..............page:933-936

Study of Layout-Induced Failure in ESD Protection Circuit in CMOS IC
TAO Jian-lei;FANG Pei-yuan;WANG Jia-ji

..............page:1003-1006

OCP Transactions-Based SOC Debug Controller
TANG Shan;XU Qiang;DING Wei

..............page:999-1002

Research and Design of a Memory Controller Based on Microprogramming
XU Yun-wen;CAI Min

..............page:995-998

Design of a Low-Phase-Noise VCO
HE Yong;ZENG Jian-ping;WEN Hua-feng;XIE Hai-qing

..............page:992-994

Design of 2.4 GHz Low-Phase-Error Low-Phase-Noise CMOS QVCO
GAO Hui;L(U) Zhi-qiang;LAI Feng-chang

..............page:988-991

Influence of IMC Growth on Reliability of Lead-Free Solder Balls
SHEN Meng;HUA Tong;SHAO Bing-xian;WANG Jun

..............page:929-932

Fabrication of Gold Stud Bumps for Flip Chip
WU Yan-hong;YANG Heng;TANG Shi-yi

..............page:926-928

Lithography Technology for Sub-65 nm Nodes and Beyond
XU Xiao-dong;WANG Hui

..............page:921-925