1003-353X
2007 Issue 2
The Development of the Study on Selectively Growth of GaN
ZHANG Wei;LIU Cai-chi;HAO Qiu-yan
ZHANG Wei;LIU Cai-chi;HAO Qiu-yan
..............page:93-96
Progress of High k Materials as Gate Dielectrics
CAI Wei;FU Chun-Lin;CHEN Gang
CAI Wei;FU Chun-Lin;CHEN Gang
..............page:97-100
..............page:101-105
Study on Growing Rate in Φ200 mm CZ Si Growth
REN Bing-yan;YANG Jian-kun;LI Yan-lin
REN Bing-yan;YANG Jian-kun;LI Yan-lin
..............page:106-108,120
Influence of Nano-Particle on Grain Boundary Barrier Structure of TiO2 Varistor Ceramics
YAN Ji-kang;GAN Guo-you;CHEN Hai-fang;ZHANG Xiao-wen;SUN Jia-lin
YAN Ji-kang;GAN Guo-you;CHEN Hai-fang;ZHANG Xiao-wen;SUN Jia-lin
..............page:109-112
Fiber Coupling Technique for High-Power Diode Laser 2D Arrays
LIU Xiu-ling;XU Hui-wu;ZHAO Run;WANG Ju-bo;HUA Ji-zhen;CHEN Guo-ying
LIU Xiu-ling;XU Hui-wu;ZHAO Run;WANG Ju-bo;HUA Ji-zhen;CHEN Guo-ying
..............page:113-116
Design of a High-Linearity CMOS Mixer
Wu Ming-ming;YE Shui-chi
Wu Ming-ming;YE Shui-chi
..............page:117-120
Finite-Difference Time-Domain Method for the Numerical Analysis of Thin-Film Bulk Acoustic Wave Resonators
CHI Zhi-peng;Zhao Zheng-ping;L(U) Miao;YANG Rui-xia
CHI Zhi-peng;Zhao Zheng-ping;L(U) Miao;YANG Rui-xia
..............page:121-124
The Technology and Application of OADM
GUO Zheng-hua;CHEN Gen-xiang
GUO Zheng-hua;CHEN Gen-xiang
..............page:125-128,141
..............page:129-132
Wet Etching of Ti in the Microelectronic Manufacture
CHEN Dan;SHEN Zhuo-shen;REN Zhong-ping
CHEN Dan;SHEN Zhuo-shen;REN Zhong-ping
..............page:133-137
Study on Surface Evolution of Cu Thin Films Deposited by Magnetron Sputtering Technology
LUO Xiang-dong
LUO Xiang-dong
..............page:138-141
Lead-Free Transfer and Transition Technology
PAN Kai-lin;ZHOU Bin;YAN Yi-lin;WEI Li-pu
PAN Kai-lin;ZHOU Bin;YAN Yi-lin;WEI Li-pu
..............page:142-146
Design of a High-Order 1-Bit Interpolative Sigma-Delta Modulator
ZHOU Hao;CAO Xian-guo;LI Jia-hui
ZHOU Hao;CAO Xian-guo;LI Jia-hui
..............page:147-149,166
Research on Extrinsic Digital Circuit Evolutionary Design
WU Hui-cong;SONG Xue-jun;ZHAO Qiang;YUAN Liang;LIU Shang-he
WU Hui-cong;SONG Xue-jun;ZHAO Qiang;YUAN Liang;LIU Shang-he
..............page:150-153
..............page:后插1
..............page:183-184
..............page:183
..............page:182
Effect of Rapid Thermal Annealing on the Measurement of Iron in Oxidized Wafers with Surface Photo-Voltage
YANG Fu-bao
YANG Fu-bao
..............page:178-181
Method for Extracting Chip S-Parameters by TRL Calibration
DONG Si-hua;LIU Ying-kun;FENG Bin;SUN Yan-ling
DONG Si-hua;LIU Ying-kun;FENG Bin;SUN Yan-ling
..............page:174-177
Principles of Digital Down Converter HSP50216 and the Use of Its Test Mode
LUO Ya-song;GAO Jun
LUO Ya-song;GAO Jun
..............page:170-173
Thermal Stress Analysis and Optimization in Stacked Die Package Under Power Load
YIN Jing-hua;DU Bing;WANG Shu-qi;L(U) Guang-jun;LIU Xiao-wei
YIN Jing-hua;DU Bing;WANG Shu-qi;L(U) Guang-jun;LIU Xiao-wei
..............page:167-169,181
Research on the Low Power Dissipation of Pipeline ADC
LI Bo;LI Zhe-ying
LI Bo;LI Zhe-ying
..............page:162-166
Analysis and Design of LDMOS Microwave Power Amplifier
HAN Hong-bo;HAO Yue;FENG Hui;LI De-chang
HAN Hong-bo;HAO Yue;FENG Hui;LI De-chang
..............page:158-161
Optimizing Design Approach of Integrated Inductor
LI Zheng;LI Zhe-ying
LI Zheng;LI Zhe-ying
..............page:154-157