Semiconductor Technology 2007 Issue 5 ban dao ti ji shu gao yue

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zong he xin wen

..............page:459-460

ae geng yun zhong guo shi chang fu wu zhong guo ke hu ( cai fang 1)/sez gong si xin tui chu dan jing yuan shi fa chu li ji shu 3( cai fang 2)

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qian xi she ji gong si de cheng gong zhi lu
wu bo

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gao ling min du chuan gan qi shi xian dong zuo shi bie , man zu xiao fei dian zi shi chang xu qiu
fei si ka er ban dao ti ( zhong guo ) you xian gong si

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Dynamic Testing System for Power Microwave Devices
LAI Ping;ZHANG Xiao-ming;RONG Bing-lin;FENG Jing-dong;FAN Guo-hua;JIN Yu-quan

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Application of QuickTest Solution in Current Semiconductor Test Industry
LEE Moods

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Causation and Improvement of Lip Effect in BGA Substrate Singulation Process
YUAN Jie;ZHAO Ning;NAN Jun-ma;HAN Yong;XU Ke-wei

..............page:443-446

High Frequency Noise Characteristics of SiGe HBTs
GAO Pan;ZHANG Wan-rong;XIE Hong-yun;QIU Jian-jun;SHA Yong-ping;JIN Dong-yue;ZHANG Jing;ZHANG Zheng-yuan;LIU Dao-guang;WANG Jian-an;XU Xue-liang;CHEN Guang-bing

..............page:394-396,405

Application of ARIMA Model in Semiconductor Demand Forecasting
NIU Yi-jun;QIAN Xing-san;REN Jian-hua

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Effect of Organic Additives on Pulsed Electroplating of Cu Interconnect
CHEN Min-na;ZENG Lei;WANG Li-kang;ZHANG Wei;XU Sai-sheng;ZHANG Li-feng

..............page:387-390

Technology Analysis on Copper CMP Slurry in ULSI Manufacturing
LI Qing-zhong;GUO Dong-ming;KANG Ren-ke

..............page:382-386

Application of Adhesives in High Reliability Microelectronic Packages
SUN Rui-hua;SHAO Chong-jian

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Formation and Effects of Void in VDMOS Die Attach Process
PAN Shao-hui;HE Lun-wen;WANG Li-Kang;ZHANG Wei

..............page:436-439

Design of Low-Power Operation Amplifier for ∑-△ ADC
AI Wan-peng;HUANG Lu;WANG Jian-she

..............page:433-435

General Impedance Converter based on AOA and it's Application
LI Yong-an

..............page:430-432

Design of IP Core Based on 1553B Bus
YAN Xue-long;MEI Ming

..............page:426-429

Analysis of High Speed and Low-Power RTD-HBT Ring Oscillator
WANG Xiao-li;NIU Ping-juan;LIU Hong-wei;GUO Wei-lian;MAO Lu-hong;YANG Guang-hua

..............page:422-425,450

CMOS Narrow-Band LNA Design Optimization with Low-Power Dissipation
MAO Xiao-feng;LAN Jia-long;HUANG Chao-gang

..............page:417-421

Microchannel Plate Cleaning Technique
WANG Yi-jun;YAN Cheng;ZENG Gui-lin

..............page:413-416

Silicon Epitaxy Material for PIN Diode
YIN Hai-feng;XU Yong-kuan;XUE Bing

..............page:410-412

Research on Material Growth of Long Wavelength SiGe Photodectors
LI Huan;NIU Ping-juan;LI Jun-yi;ZHANG Yu;WANG Wei

..............page:406-409

Study on Process Simulation of Microwave Power LDMOS
FENG Bin;LIU Ying-kun;SUN Yan-ling;DUAN Xue;DONG Si-hua

..............page:402-405

Simulation Study of Electrical Properties of CMOS Based on Strained Si/SiGe
SHU Bin;ZHANG He-ming;REN Dong-ling;WANG Wei

..............page:397-401

Influence of Current Crowding for Cu Interconnects
REN Tao;WENG Yan;XU jie-jing;WANG Hui

..............page:378-381

Technology of System in Package and Its Applications Prospects
HAN Qing-fu;CHENG Li;YAN Xue-ping;ZHANG Hui;LIU De-lin;LI Jun;XU Zhi-chun

..............page:374-377,386

R&D on the Technique for Determining the Resistivity of Micro Areas Sheet Based on Four-Point Probe and EIT
XIE Hui;LIU Xin-fu;JIA Ke-jin;YAN De-li;TIAN Jian-lai

..............page:369-373