1003-353X
2007 Issue 8
..............page:737
..............page:734-736
quan guo da xue sheng zhi neng che jing sai yu fei si ka er s12 dan pian ji
fei si ka er ban dao ti ( zhong guo ) you xian gong si
fei si ka er ban dao ti ( zhong guo ) you xian gong si
..............page:732-733
Design and FEA Simulation of Electrothermal Micro Gripper with Laser Micro Fabrication
YAN Xue-ping;ZHANG Hui;HAN Qing-fu;LI Jun;CHENG Li;XU Zhi-chun;LIU De-lin
YAN Xue-ping;ZHANG Hui;HAN Qing-fu;LI Jun;CHENG Li;XU Zhi-chun;LIU De-lin
..............page:727-731
Manual Operating Technology of SMT
SUN Mei-hua
SUN Mei-hua
..............page:723-726
Modeling and Predicting Solder Yield of Ball Gray Array
WEI He-lin;WANG Kui-sheng
WEI He-lin;WANG Kui-sheng
..............page:718-722
Optimal Parameter Design and Modeling Valiation for Inner Lead Bonding
ZHANG Lei;HE Lun-wen;WANG Li-kang;ZHANG Wei
ZHANG Lei;HE Lun-wen;WANG Li-kang;ZHANG Wei
..............page:714-717
Comparison of Application of Wavelet-Based Image Enhancement Algorithm in Non-Destructive Testing
HOU Hui-ling;WANG Ming-quan
HOU Hui-ling;WANG Ming-quan
..............page:710-713
Design of Supper High- Speed Biphase RF Pulse Code Modulator
ZHAO Rui-hua;JIN Sen;WANG Zhan-li
ZHAO Rui-hua;JIN Sen;WANG Zhan-li
..............page:707-709
A 1.8 GHz CMOS Class-E Power Amplifier with High Efficiency
DU Chun-shan;CHEN Chang-yong;LIU Zhang-fa
DU Chun-shan;CHEN Chang-yong;LIU Zhang-fa
..............page:703-706
Microchannel Plate Double-Sided Polishing Technology
YAN Cheng;JIN Ge;WANG Yi-jun;ZHANG Zheng-jun;SUN Jian-ning;SU De-tan
YAN Cheng;JIN Ge;WANG Yi-jun;ZHANG Zheng-jun;SUN Jian-ning;SU De-tan
..............page:653-656,676
New Material to Maintain Moore's Law: Strained Si
REN Dong-ling;ZHANG He-ming;SHU Bin;HU Qiu-jin;SONG Jian-jun
REN Dong-ling;ZHANG He-ming;SHU Bin;HU Qiu-jin;SONG Jian-jun
..............page:650-652
Advances of High Density Interconnect and Its Materials
LIU De-lin;CHENG Li;HAN Qing-fu;LI Jun;XU Zhi-chun;ZHANG Hui
LIU De-lin;CHENG Li;HAN Qing-fu;LI Jun;XU Zhi-chun;ZHANG Hui
..............page:645-649
Research on Diversity Reception in DS/SS Communication with Adaptive Filter
ZHEN Zhong-jian;CHEN Li
ZHEN Zhong-jian;CHEN Li
..............page:700-702,722
Design of Digital UWB Pulse Generator
FU Dian-hua;DUAN Ji-hai
FU Dian-hua;DUAN Ji-hai
..............page:697-699
Research on the Soft IP Core Design Method of the Ethernet MAC Layer
ZHOU Hua-mao;CHENG Xiao-hui;GONG You-min
ZHOU Hua-mao;CHENG Xiao-hui;GONG You-min
..............page:692-696
Application of Infrared Measurement Technology in MOCVD
LU Meng-xi;CAO Jian
LU Meng-xi;CAO Jian
..............page:689-691,731
Influence of Excited States of Acceptors on Ionization of Dopants in SiC
DAI Zhen-qing;YANG Ke-wu;YANG Rui-xia
DAI Zhen-qing;YANG Ke-wu;YANG Rui-xia
..............page:685-688,706
..............page:682-684
Growth and Properties of ZnO Nanorod with UV-Light
BIE Ya-qing;YE Ying-bo;ZHAN Zi-min;LIN San-jing;ZHENG Dong;WANG Yin-shu
BIE Ya-qing;YE Ying-bo;ZHAN Zi-min;LIN San-jing;ZHENG Dong;WANG Yin-shu
..............page:677-681
Design of Automobile Ellipsoid Headlight Based on High Power LED
SU Sheng-jun;CHEN Xiang-xi;SHI Wei-bin;ZHU Wei-tao
SU Sheng-jun;CHEN Xiang-xi;SHI Wei-bin;ZHU Wei-tao
..............page:673-676
High-Frequency Noise Modeling in Deep Submicron MOSFET
L(U) Zhi-qiang;LAI Feng-chang;YE Yi-zheng
L(U) Zhi-qiang;LAI Feng-chang;YE Yi-zheng
..............page:669-672,713
Application of X-Factor Theory in the Semiconductor Wafer Fabrication
XU Sheng-liang;QIAN Xing-san;MA Hui-min;REN Jian-hua
XU Sheng-liang;QIAN Xing-san;MA Hui-min;REN Jian-hua
..............page:665-668
Introducing Advanced Planning and Scheduling System in Semiconductor Manufacturing
SHAO Zhi-fang;QIAN Xing-san;LIU Zhong-ying
SHAO Zhi-fang;QIAN Xing-san;LIU Zhong-ying
..............page:661-664
Application of CeO2 Slurry on Chemical Mechanical Planarization
XU Huai;CHEN Xiu-lan
XU Huai;CHEN Xiu-lan
..............page:657-660