1003-353X
2008 Issue 11
..............page:1049,1051
..............page:1050-1051
fei si ka er flexis ac wei kong zhi qi xi lie zhen dui da xing jia dian shi chang jin xing you hua
fei si ka er ban dao ti ( zhong guo ) you xian gong si
fei si ka er ban dao ti ( zhong guo ) you xian gong si
..............page:1048-1049
Design of 8 bit 800 Msps High-Speed Sample-and-Hold Circuit
Pan Xing;Wang Yonglu;Zhang Zhengping
Pan Xing;Wang Yonglu;Zhang Zhengping
..............page:1044-1047
Low-Noise 2×8 ROIC Design for InGaAs/InP APD System
Huang Jing;Guo Fangmin;Wang Zhiliang
Huang Jing;Guo Fangmin;Wang Zhiliang
..............page:1041-1043
Functional Verification of a Multi-Protocol Serial Communication Controller with Eight Channels
Zhou Zhe;He Shuzhuan;Li Wei;Lou Xiaoxiang;Zhang Zhongjin;LiLi
Zhou Zhe;He Shuzhuan;Li Wei;Lou Xiaoxiang;Zhang Zhongjin;LiLi
..............page:1036-1040
Thermal Resistance Test of Small Outline Diode
Bao Ailin;Deng Aimin;Fu Jianfeng;Guan Guodong
Bao Ailin;Deng Aimin;Fu Jianfeng;Guan Guodong
..............page:1032-1035
Experimental Investigation on Vibration Fatigue Life of PBGA Assembly
Chen Zixia;Yang Ping;Tan Guangbin
Chen Zixia;Yang Ping;Tan Guangbin
..............page:1028-1031
Study on Failure Modes and Failure Mechanisms of Transient Voltage Suppressor
Li Mingxiu;Jia Ying
Li Mingxiu;Jia Ying
..............page:1024-1027
Analysis of Vibration Characteristics of Bonding Tool in Ultrasonic Transducer System
Lv Lei;Han Lei
Lv Lei;Han Lei
..............page:1020-1023,1031
Study on the Influence of Abrasive and H2O2 on InSb CMP
Zhang Wei;Liu Yuing;Sun Wei;Tang Wendong;Zong Simiao;Li Xianzhen;Hou Lihui
Zhang Wei;Liu Yuing;Sun Wei;Tang Wendong;Zong Simiao;Li Xianzhen;Hou Lihui
..............page:1016-1019
Study on ELO Technology and Characteristic of GaN
Peng Xiaolei;Niu Pingjuan;Tian Haitao;Li Xiaoyun;Zhan Ying;Liu Wei
Peng Xiaolei;Niu Pingjuan;Tian Haitao;Li Xiaoyun;Zhan Ying;Liu Wei
..............page:1011-1015
Device Development and MESFET Epitaxy Growth on Domestic 4H-SiC SI Substrate
Chen Hao;Shang Qingjie;Hao Jianmin;Qi Guohu;Huo Yuzhu;Yang Kewu
Chen Hao;Shang Qingjie;Hao Jianmin;Qi Guohu;Huo Yuzhu;Yang Kewu
..............page:1007-1010
Micro-Defects and Minority Carrier Lifetime of FZ-Si Single Crystal with High Resistivity Grown in Vacuum
Yan Ping;Zhang Dianchao;Pang Bingyuan;Suo Kainan
Yan Ping;Zhang Dianchao;Pang Bingyuan;Suo Kainan
..............page:1003-1006
Study on the Reliability Increasing of Glass Diode
Han Wenjue;Wang Haifeng;Luo Chunlian;Tian Haibing
Han Wenjue;Wang Haifeng;Luo Chunlian;Tian Haibing
..............page:961-964,1040
Wire Bonding Model Based on BP Neural Network
Luo Zhiyun;Gao Jian;Chen Xin
Luo Zhiyun;Gao Jian;Chen Xin
..............page:956-960
Potential Failure Mechanism of BGA Solder on Double-Sided Board
Lu Yudong;He Xiaoqi;En Yunfei;Wang Xin;Zhuang Zhiqiang
Lu Yudong;He Xiaoqi;En Yunfei;Wang Xin;Zhuang Zhiqiang
..............page:952-955
Method for Eliminating the Influence of Temperature on the Alignment Precision in Flip-Chip Bonding
Zhang Lina;Han Lei
Zhang Lina;Han Lei
..............page:947-951
Development of Room Temperature CdZnTe Nuclear Radiation Detector
Li Xia;Chu Junhao;Li Longxia;Dai Ning;Sun Jinglan;Zhang fujia
Li Xia;Chu Junhao;Li Longxia;Dai Ning;Sun Jinglan;Zhang fujia
..............page:941-946
Review on Development of IGBT Technology
Ye Lijian;Zou Mian;Yang Xiaohui
Ye Lijian;Zou Mian;Yang Xiaohui
..............page:937-940,951
Method for Reducing the Warp of VB-GaAs Wafer
Lv Fei;Zhao Quan;Yu Yan;Qin Xuemin;Song Jing
Lv Fei;Zhao Quan;Yu Yan;Qin Xuemin;Song Jing
..............page:1000-1002
Electrical Characterization of Ultra-Thin Gate Dielectrics Generated by ISSG Process
Sun Ling;Gao Chao;Wang Lei;Yang Huayue
Sun Ling;Gao Chao;Wang Lei;Yang Huayue
..............page:995-999
Deposition and Properties of Transparent Conducting Zirconium-Doped Zinc Oxide Films
Liu Hanfa;Zhang Huafu;Lei Chengxin;Yuan Changkun
Liu Hanfa;Zhang Huafu;Lei Chengxin;Yuan Changkun
..............page:991-994
Study on Surface Morphology of GaN Grown on Sapphire by HVPE
Xu Yongkuan;Cheng Hongjuan;Yang Wei;Yu Xianglu;Lai Zhanping;Yan Ruyue
Xu Yongkuan;Cheng Hongjuan;Yang Wei;Yu Xianglu;Lai Zhanping;Yan Ruyue
..............page:988-990
XRD Study on Cu Layer in IC Interconnect
Xu Saisheng;Zeng Lei;Zhang Lifeng;Gu Xiaoqing;Zhang Wei;Wang Likang
Xu Saisheng;Zeng Lei;Zhang Lifeng;Gu Xiaoqing;Zhang Wei;Wang Likang
..............page:985-987
Study on the Capability of Adhesion of Monocrystalline Si Wafer Cutting Fluid
Ning Peihuan;Zhou Jianwei;Liu Yuling;Tang Wendong;Zhang Wei
Ning Peihuan;Zhou Jianwei;Liu Yuling;Tang Wendong;Zhang Wei
..............page:981-984
Simulation Analysis of the Filling Process of Polymer in Hot Embossing
Chu Jinkui;Guo Qing;Meng Fantao;Han Zhitao
Chu Jinkui;Guo Qing;Meng Fantao;Han Zhitao
..............page:976-980
Study on the Capability of Nonionic Surface Active Agent in ULSI Copper Polishing Slurry
Li Qingzhong;Zhang Ran;Guo Dongming
Li Qingzhong;Zhang Ran;Guo Dongming
..............page:972-975
Novel Body-Contact Structure Technology for Partially Depleted SOI MOSFET
Song Wenbin;Bi Jinshun;Han Zhengsheng
Song Wenbin;Bi Jinshun;Han Zhengsheng
..............page:968-971
Design of Encapsulation Process and Universal MGP Mould for IC SOP Series
Cao Yanggen;Li Xiaolin;Zhang Enxia;Miao Yelin;Shu Jun;Wu Lei
Cao Yanggen;Li Xiaolin;Zhang Enxia;Miao Yelin;Shu Jun;Wu Lei
..............page:965-967,975