Semiconductor Technology 2008 Issue 12 Design and Fabrication of Wide Band and Low Phase Noise L Band VCO

Design and Fabrication of Wide Band and Low Phase Noise L Band VCO
Chen Juntao;Yao Zhihong

..............page:1130-1132

Design and Implementation of the Decimation Filter for ∑-△ ADC
Ye Zhenwei;Cai Min

..............page:1133-1137

Application of LVDS Difference Interface Based on FPGA
Li Yunzhi;Li Liping;Yang Heng

..............page:1138-1142

Low Jitter Clock Stabilizer for High-Speed ADC
Zhang Hong

..............page:1143-1147

fei si ka er tui chu xin xi lie dai lcd qu dong de dan pian ji yi jiang di xi tong cheng ben gong hao he fu za xing
fei si ka er ban dao ti you xian gong si

..............page:1148

Design of 3.7 GHz Wideband CMOS LC VCO
Wang Yunfeng;Ye Qing;Man Jiahan;Wu Yongjun;Chen Yong;Ye Tianchun

..............page:1126-1129

Rail to Rail Programmable Comparator
Fan Tao;Zhang Zheng;Yuan Guoshun;Peng Jie;Huang Qiang

..............page:1123-1125,1142

Novel High-Speed Low-Power Dynamic Comparator
Lin Wuping;Guo Liangquan;Yu Zongguang;Huang Zhaojun

..............page:1119-1122,1147

DC to 40 GHz Reflective GaAs MMIC SPST Switch
Fang Yuan;Li Fuqiang;Gao Xuebang;Wu Hongjiang;Wei Hongtao;Liu Wenjie

..............page:1115-1118

Study on X-Band GaN MMIC with Homemade SiC Substrate
Zhang Zhiguo;Feng Zhen;Wu Jibin;Wang Yong;Cai Shujin;Yang Kewu

..............page:1112-1114

Research on the Screening Qualification and DPA Technology for Plastic Encapsulated Microcircuit
Lin Xiangyun;Lai Ping;Liu Jian;Li Shaoping

..............page:1108-1111

Design of Universal Precision Hard Alloy Progressive Die of LET Lead Frame
Cao Yanggen;Zhang Enxia;Qin Xiuzhen;Liu Xiaoqian

..............page:1105-1107,1132

Novel Method of Boundary-Scan Interconnection Fault Diagnosis for Digital ICs
Zhou Xiaoxia;Ni Jun;Cheng Li;Zhi Wanjiang;Wang Zhenyu

..............page:1100-1104

On-Line Testing Technologies for SiC MESFET
Shang Qingjie;Pan Hongshu;Chen Hao;Li Liang;Yang Fei;Huo Yuzhu

..............page:1095-1099

Effect of the Grain Size of Grinding Wheel on Surface Damage in Grinding of Si Wafer
Tang Xingchang;Xiao Qinghua;Zhou Qigang;Yan Zhirui

..............page:1091-1094

Study on the Influence of Chamber Wall Condition on Etch Process
Chen Lele;Zhu Liang;Bao Dayong;Ji Gaoming;Cai Hui;Li Dongxia

..............page:1088-1090,1094

Study on the Influence of Pad Lifetime on 300 mm Si Wafer Surface Haze
Suo Sizhuo;Ku Liming;Huang Junhui;Ge Zhong;Chen Haibin;Zhang Guodong;Sheng Fangyu;Yan Zhirui

..............page:1084-1087

Process of TFT 5PEP of Back-Channel-Etching and Back-Channel Protection
Xin Yujie;Yu Chunqi

..............page:1080-1083

Analysis of Acid Etching on Ge Wafers
Lü Fei;Zhao Quan;Liu Chunxiang;Yang Hongxing;Qin Xuemin;Zhao Xiuling

..............page:1077-1079

Highly Precise Determination of Optical Material Parameters with THz Time-Domain Spectroscopy
Li Yazhuo;Li Xiangjun;Hong Zhi

..............page:1074-1076,1099

Properties Comparison of Electrodeposited Copper Interconncet Line by DC and Pulse Plating
Xu Saisheng;Zeng Lei;Zhang Lifeng;Zhang Wei;Wang Likang

..............page:1070-1073

Relationship Between Resistance and Temperature of Microwave pin Diode
Gu Xiaochun;Wu Sihan

..............page:1066-1069,1073

Application of LED Lamp-House Technology on Coal Excavation Working Face
Sun Jianling

..............page:1062-1065

Research on the Correlation Between DC/DC Converter Irradiation Damages and VDMOS 1/f Noise
Wang Danghui;Xu Tianhan;Wang Dangchao;Cao Kan

..............page:1057-1061

Simulation Research on CMOS Device with Multiple Stressors
Shi Hao;Zhou Dong;Zhang Qingdong;Gu Xiaofeng

..............page:1054-1056,1083

Organic LED Based on a Novel Cohost Electron Transport Layer
Wei Fuxiang;Fang Liang;Jiang Xueyin;Zhang Zhilin

..............page:1051-1053