Semiconductor Technology 2008 Issue 3 ban dao ti ji shu gao yue yong tou gao ge shi

ban dao ti ji shu gao yue yong tou gao ge shi

..............page:215

zong he xin wen

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zhu li chao ji yi dong pc fei si ka er dai lai " pian shang zhu ban " chu li qi
fei si ka er ban dao ti ( zhong guo ) you xian gong si

..............page:275-276

Modeling Via Hole Structure in MMIC
Hu Zhifu;Wang Shengguo;He Dawei;Cai Shujun

..............page:272-274

Modeling and Verifying for Data Retention Capability of Metal Nanocrystal Memory Device
Gu Huaihuai;Cheng Xiulan;Shi Liang;Lin Kun

..............page:269-271,274

Design Verification Strategy of One-Chip TFT-LCD Driver IC
Cheng Peng;Wei Tingcun;Wei Xiaomin;Li Bo

..............page:264-268

Study on TLP Test Equipment Based on New Matched Load Circuit
Li Jiaying;Zhou Jicheng;Luo Hongwei

..............page:261-263,268

Design of 5.8 GHz CMOS Mixer
Ren Huailong;Mo Lidong;Wu Sihan;Chen Xing;Feng Wei;Liao Bin;Wu Hongjiang

..............page:257-260

Low-Power Successive Approximation ADC Design Using Switched-Opamp
Qiao Junshi;Li Dongmei

..............page:252-256

Thermal Analysis of Finite Element for High-Power LED Packaging
Tian Dalei;Guan Rongfeng;Wang King

..............page:248-251

Failure Mechanism and Improvement of WSix Pre-Clean for Deposition
Sun Zhenhai;Guo Guoehao;Han Ruijin

..............page:245-247,256

Research on Chemical Erosion Mechanism in LiTaO3 CMP Process
Du Hongwei;Wei Xin;Lin Yuexiang;Pan Zhiguo;Jiang Jingtao

..............page:242-244

Improved Driving Circuit of OLED Pixel
Jiao Yubin;Xu Yanlei

..............page:239-241

Influence of Nonparabolicity Rate in Si Band on Carrier Transport Properties in MOSFET
Li Haixia;Mao Lingfeng

..............page:235-238

Research and Modeling Kink Effect in Poly-Si Thin Film Transistors
Chen Rongsheng;Zheng Xueren;Deng Wanding;Yao Ruohe;Wu Zhaohui;Wu Weijing

..............page:231-234

Study on Characteristics of a Dual-Material Gate LDMOS
Hong Qi;Chen Junning;Ke Daoming;Liu Lei;Gao Shan;Liu Qi

..............page:227-230

Common Technologies and Novel SOI MOSFET Device Structures for Minimizing Total Dose Radiation Damage
He Yujuan;Liu Jie;En Yunfei;Luo Hongwei;Shi Qian

..............page:223-226

Novel Structure of InP Based HBT with Composite Doping Layer
Jiang Linlin;Li Yiqun;Cui Hailin;Huang Hui;Huang Yongqing;Ren Xiaomin

..............page:220-222

Intelligent Gas Concentration Measurement Device Based on Newtonian Interpolation Algorithm
Li Xiaoli;Sun Yicai;He Ping;Zhong Xiaoquan;Li Xiaolin

..............page:216-219

Development and Application of Spectral Response On-Line Tester
Niu Jun;Qiao Jianliang;Chang Benkang

..............page:212-215

Development of Cleaning Equipment for Microchannel Plate
Yan Cheng;Wang Yijun;Zhang Zhengjun;Su Detan;Cong Xiaoqing;Wang Ruiting

..............page:208-211

Study on the System of LED Die Bonder Based on PCI Bus
Zou Songqing;Liu Xueping;Duan Guanghong;Wu Xiaofeng

..............page:204-207

Application of Improved Match Algorithm in LED Die Bonder Image Recognition
Cao Zhanlun;Wu Xiaohong;Jiang Yongjun;Lin Xiaoxin

..............page:200-203

S-Shape Curve Acceleration/Deceleration Control to Transistro Die Bonder
Wu Xiaohong;Lin Xiaoxin;Cao Zhanlun;Jiang Yongjun;Yuan XiLing

..............page:197-199

Trends of Lithography Technology & Equipments for Semiconductor Fabrication
Yao Da;Liu Xin;Yue Shizhong

..............page:193-196

From SOC to NOC: Development of IC Design Technology
Meng Lilin

..............page:190-192

Recent Development of Micro Electronic Packaging Materials
Chen Junjun;Fu Yuepeng;Tian Minbo

..............page:185-189