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Semiconductor Technology
1003-353X
2008 Issue 5
Epitaxial Technology for Buried-Gate Static Induction Device
Lei Jingli;Li Siyuan;Li Hairong;Li Haixia
..............page:384-387
Research on Photoluminescence and Electroluminescence of Si-Rich SiN Films
Huang Jianhao;Li Dongsheng;Wang Minghua;Yang Deren
..............page:388-390,421
Investigation on 200 mm High Resistivity Thick Epitaxy Layer Technology
Yuan Zhaogeng;Wei Yufeng
..............page:391-393,449
Condition Analysis of Double Polishing Process of Ge Wafers
Liu Chunxiang;Yang Hongxing;Zhao Quan
..............page:394-396
Study of Internal Stress in PECVD SiO2 Thin Films
Sun Junfeng;Shi Xia
..............page:397-400
Optimal Process Parameter Design of CNP Based on DOE
Lu Haishen;He Liang'en;Liu Jiangang
..............page:401-403
New Checking Method of Optocoupler Burst Noise Based on Singularity of Noise
Xie Duan;Zhao Jian;Wang Danghui;Guo Xiumei
..............page:404-408
Fabrication and Test of Novel 3D Stacked Packages
Fan Hanhua;Cheng Li;Zhi Wanjiang;Wang Ling;Yi Tinrong
..............page:409-413
Study on SIP Based on LTCC Technology
Hong Qiulong;Wu Hongjiang;Wang Shaodong
..............page:414-416
Study on Testing Technology of GaN Epilayers
Liu Yuewei;Chen Hongjiang;Gao Meng;Zhang Zhiguo;Gao Jinhuan;Yan Deli;Yang Yong
..............page:422-424
Design of SiGe HBT Low-Noise Amplifier Based on IEEE802.11a
Li Jia;Zhang Wanrong;Xie Hongyun;Zhang Wei;Shen Pei;Gan Junning
..............page:425-427,445
PIN Photodetector Small Signal Model Paramters Extraction Using Improved Genetic Algorithm
Mei Wenli;Huang Yongqing;Ren Xiaomin
..............page:428-430
Industry Nwes
..............page:460-461
fei si ka er flexis jm kong zhi qi xi lie ling huo qi dong usb lian jie de kai fa
fei si ka er ban dao ti ( zhong guo ) you xian gong si
..............page:458-459
Reliability Design and Analysis on Integrated VCO
Liu Xiaohong;Guo Wensheng;Wang Heli;Chang qingsong
..............page:450-453
Design Reuse and Process Migration of Hard IP in SOC Design
Hong Ruihuang;Wang Yunfeng;Guo Donghui
..............page:446-449
Design of X Band 2 W Microwave Power Module
Ce Jiangna
..............page:443-445
Design and Implementation of Universal Modulating-Demodulating Module in OFDM System
Huai Yongjin;Qu Xiaosheng;Han Zhengsheng
..............page:440-442
Novel MEMS Gas Sensor and Its Theoretical Model
Yan Jun;Chen Xiangdong;Li Hui;Su Feng;Luo Xuesong
..............page:435-439
Design and Realization of Driving Circuit for Phase-Change RAM Chip
Shen Ju;Song Zhitang;Liu Bo;Feng Songlin
..............page:431-434
Application of BP Neural Network Methodology in Design of HV LDMOS
Cheng Dongfang;Lü Hongtao;Zhang Zhengdong
..............page:381-383,408
LTCC Technology for Fabrication and Application of MMCM
Bian Guohui;Fang Yibo;Wu Xiaoshuai
..............page:378-380
Investigation Status on Cu Interconnection and Its Key Technologies
Zhao Chaorong;Du Huan;Liu Mengxin;Han Zhengsheng
..............page:374-377
Advances in Post-CMP Cleaning Technology
Lei Hong
..............page:369-373