1003-353X
2009 Issue 11
Bond-Wire Matching Techniques of InGaP/GaAs HBT Power Amplifier
feng wei ; liu jian
feng wei ; liu jian
..............page:1062-1065
Optimized Method of Multi-Layer Stacked Chip Package Scheme
zheng jian yong ; chen yi zuo ; zhang zhi sheng ; shi jin fei
zheng jian yong ; chen yi zuo ; zhang zhi sheng ; shi jin fei
..............page:1058-1061
..............page:1053-1057
Study on Electroplating of Au-Sn Alloy
zhang jing ; xu hui wu ; li xue yan ; su ming min ; chen guo ying
zhang jing ; xu hui wu ; li xue yan ; su ming min ; chen guo ying
..............page:1066-1069
Effect of Substrate Surface Smoothness on Thin Al Wire Wedge Bonding Strength
xi jian fei ; zhang fang zuo
xi jian fei ; zhang fang zuo
..............page:1070-1073
Model and Fabrication of Integrated Micro-Inductors Based on Ceramic Substrate
wang jian wei ; cai jian ; zuo xin yu ; wang shui di
wang jian wei ; cai jian ; zuo xin yu ; wang shui di
..............page:1074-1077
Discussion on How to Improve Final Test Yield of Power MCM
shao yi qiong ; wang hui ; ren zuo xing
shao yi qiong ; wang hui ; ren zuo xing
..............page:1078-1081