Semiconductor Technology 2010 Issue 2 Application Analysis on TDDB Physical Mechanism

Application Analysis on TDDB Physical Mechanism
jian wei ting ; zhao yong ; zhang rong zhe

..............page:154-158

Progress and Failure Mechanism of VDMOS Device in DC/DC Power Supply
chen jing bo ; he xiao zuo ; zhang xiao wen

..............page:176-180

Reliability Analysis of CiP Based on Embedded Chip Technology
niu li gang ; yang dao guo ; zhao ming jun

..............page:162-165

XPS Study on Interfacial Properties Between ZrN Diffusion Barrier Layer and SiCON Low-k Dielectric Film
yang chun xiao ; zhang chi ; xu sai sheng ; ding shi jin ; zhang wei

..............page:105-108

Research on Monocrystalline Silicon Surface Etching
chen gang ; ma xun ; liu zu ming ; liao hua ; li jing tian ; liu jian hong

..............page:137-141

Influence of High-Power White LED Packaging Technology on LED Life Time
tu zhao lian ; wang guo ding

..............page:181-185

Design and Fabrication of Microwave Frequency Multiplier
wu xiao shuai ; zhang qiang ; chen hong jiang

..............page:198-200

TEM Sample Preparation Technique for Deep Trench Structure Observation
zhang qi hua ; gao qiang ; li ming ; niu chong shi ; jian wei ting

..............page:169-171

Novel Technique for Wafer-Lever and Thin-Film Packaging Using Low-Stress PECVD SiC
wang peng cheng ; cheng li ; wu yan ; yang ning ; wang gai

..............page:150-153,165

Development of China PV Industry
sun yu xing ; yang hong ; su cheng feng

..............page:101-104

Reliability Testing of Power VDMOS Transistors in Switching State and Direct Current State
dan ni na ; lv chang zhi ; ma wei dong ; li zhi guo ; guo chun sheng

..............page:172-175

chan ye xin wen

..............page:203

Flash Memory Reliability Study About Pad Finish Used in Handhold Device
ding xing shun ; li wen shi

..............page:159-161

Study on the Resistivity Uniformity of the SI SiC
wang xiang quan ; hong ying ; wu hua ; feng zuo ; hao jian min ; yan ru yue

..............page:121-124

Research of InGaAs/InP Materials Grown by MOCVD
liu ying bin ; lin lin ; chen hong tai ; zhao run ; zheng xiao guang

..............page:113-115,120

Research on Double-Base Regions High-Power FRD
yin qi tang ; li yu zhu ; an tao ; xing yi

..............page:129-132,141

Comparative Study of TiO_2/SiO_2 and TiO_2/SiO_xN_y High-k Gate Dielectric Stacks
xu wen bin ; wang de miao

..............page:109-112

Research on the Control and Measurement of 2DEG Sheet-Density in GaAs PHEMT Materials
lv jing ; yang rui xia ; wu yi bin ; sun ying

..............page:116-120

Research on the Improving the Function Under High Temperature and Reverse Bias of Power Switch Transistor
lin jie zuo ; yang fa shun ; ma kui ; gong hong

..............page:133-136

Air Driven Boosters Combining and Analysis of Malfunction
shen cheng zhi ; ma pei sheng

..............page:166-168

Study on the Effects of Capillary Reverse Loop for Wire Profiles in Wirebonding Loops
zhou hong jun ; han lei ; wang yan fang

..............page:186-190

Study on the Influence and Optimization of Process Parameters of Tungsten Molybdenum Alloys in CMP
bian zheng ; wang sheng li ; liu yu ling ; xiao wen ming

..............page:146-149

Large Dynamic Range AGC Circuit Applied in Receiver
ma zhan gang ; zhang yu ping ; sun zuo ; wu jing feng

..............page:191-193

fei si ka er tui chu shi yong quicc engine ji shu de qoriq tong xin chu li qi

..............page:201

Design of Digital Video Circuit for VGA to TV Conversion
xue hai wei

..............page:194-197

Thermal Analytical Model for AlGaN/GaN HEMT for SiC and Sapphire Substrate
jiang xia ; zhao zheng ping ; zhang zhi guo ; luo xin jiang ; yang rui xia ; feng zhi hong

..............page:125-128

fei si ka er li tui zui xin mz xi lie wei kong zhi qi , zhong guo guo wang dian biao de zui jia xuan ze

..............page:202

Effect of Cu Lead-Frame Oxidation Time on Cu/EMC Interfaces in Power Devices
fang xing ; fang qiang ; wang ; yu hong kun ; shao xue feng

..............page:142-145