1003-353X
2011 Issue 6
Application of TEOS LPCVD Technique in SiC Power Devices Process
Hu Ling;Yang Fei;Shang Qingjie;Pan Hongshu
Hu Ling;Yang Fei;Shang Qingjie;Pan Hongshu
..............page:439-442
Multi-Band High Linearity CMOS SSB-Mixer
Sun Min;Zhang Haiying;Wang Yunfeng;Li Zhiqiang;Guo Rui
Sun Min;Zhang Haiying;Wang Yunfeng;Li Zhiqiang;Guo Rui
..............page:455-458
Study on the Adhesion Strength Between Epoxy Molding Compound and Leadframes Modified by PIII Technology
Liu Lilong;Zhang Xin;Lu Qian;Zhou Qianfei;Wu Xiaojing
Liu Lilong;Zhang Xin;Lu Qian;Zhou Qianfei;Wu Xiaojing
..............page:434-438
Study and Design on Novel Dual-Band Wilkinson Power Divider
Nan Jingchang;Shan Xiaoyan;Li Jiuchao;Mao Luhong
Nan Jingchang;Shan Xiaoyan;Li Jiuchao;Mao Luhong
..............page:459-462
Research on the Improvement of Performances for Microwave Power Bipolar Transistors
Wang Jianzhi;Pan Hongshu
Wang Jianzhi;Pan Hongshu
..............page:443-445
Design of Broadband Switch Matrices
Xu Xiangqian;Mao Wei;Zhang Yuecheng;Yue Weishan
Xu Xiangqian;Mao Wei;Zhang Yuecheng;Yue Weishan
..............page:474-477
Design of Charge Pump PLL with LC VCO
Yuan Li;Zhou Yumei;Zhang Feng
Yuan Li;Zhou Yumei;Zhang Feng
..............page:451-454,473
Effect of Surface Plating Layer on Encapsulation Quality
Chang Qingsong;Jiang Yongna
Chang Qingsong;Jiang Yongna
..............page:483-486
Measurement Method on Noise Parameters of Microwave Devices
Liang Faguo;Wu Aihua;Zheng Yanqiu
Liang Faguo;Wu Aihua;Zheng Yanqiu
..............page:478-482
..............page:493
..............page:492-493
Design and Fabrication of Ku-Band Monolithic Power Amplifier
Liu Ruqing;Wu Hongjiang;Gao Xuebang;Fu Xingchang;Ni Tao
Liu Ruqing;Wu Hongjiang;Gao Xuebang;Fu Xingchang;Ni Tao
..............page:470-473
Design and Implementation of RRAM Voltage Supply Circuits
Liao Qihong;Wu Yuxin;Lin Yinyin
Liao Qihong;Wu Yuxin;Lin Yinyin
..............page:446-450
Design of Rail-to-Rail CMOS Low-Power Operational Amplifier
Liu Huazhu;Huang Haiyun;Song Rui
Liu Huazhu;Huang Haiyun;Song Rui
..............page:463-465,482
Parylene Coating Material and Its Application
Han Jiandong;Xu Aidong
Han Jiandong;Xu Aidong
..............page:430-433
..............page:458,494-496,前插1
Fabrication of GaN Nanocolumns with Semipolar Plane Using Ni Nano-Island Masks
Yang Guofeng;Chen Peng;Yu Zhiguo;Liu Bin;Xie Zili;Xiu Xiangqian;Han Ping;Zhao Hong;Hua Xuemei;Zhang Rong;Zheng Youdou
Yang Guofeng;Chen Peng;Yu Zhiguo;Liu Bin;Xie Zili;Xiu Xiangqian;Han Ping;Zhao Hong;Hua Xuemei;Zhang Rong;Zheng Youdou
..............page:417-420,442
Fabrication and Storage Characteristics of Si-Nanocrystal Nonvolatile Memories
Yang Xiaonan;Wang Yong;Zhang Manhong;Zhang Bo;Liu Ming
Yang Xiaonan;Wang Yong;Zhang Manhong;Zhang Bo;Liu Ming
..............page:421-424
Gain Cell eDRAM Design with Stagger Hidden Refresh Scheme
Meng Chao;Yan Bing;Lin Yinyin
Meng Chao;Yan Bing;Lin Yinyin
..............page:466-469,486
Study of Preparation and Electrical Characteristics of Ta2O5 High-k Dielectric Thin Film
Chen Yongyue;Cheng Peihong;Huang Shihua
Chen Yongyue;Cheng Peihong;Huang Shihua
..............page:425-429,450
Research of Temperature Cycle Test for Electronic Assemblies
Cao Yaolong;Huang Jie
Cao Yaolong;Huang Jie
..............page:487-491