1003-353X
2012 Issue 1
Design of Dual-Band Substrate Integrated Waveguide Filters
Deng Pan;Tang Zongxi;Zhang Biao;Wu Yunqiu;Zhao Shiwei
Deng Pan;Tang Zongxi;Zhang Biao;Wu Yunqiu;Zhao Shiwei
..............page:51-54
Analysis of Damage Induced by Repetition-Frequency Optical Pulse in Semi-insulating GaAs PCSS\'s Material
Xiang Shan;Dai Huiying;Shi Wei
Xiang Shan;Dai Huiying;Shi Wei
..............page:74-77
..............page:前插1
Effect of Sb and LaB6 Addition on the Growth of Intermetallics in Sn3.0Ag0.5 Cu/Cu Solder Joints
Long Lin;Chen Qiang;Liao Xiaoyu;Li Guoyuan
Long Lin;Chen Qiang;Liao Xiaoyu;Li Guoyuan
..............page:42-46,73
High Precise MMIC Digital Attenuator with Large Attenuation
Liu Zhijun;Gao Xuebang
Liu Zhijun;Gao Xuebang
..............page:59-62
Study on Alkaline Slurry Composition Optimization in GLSI Tungsten Plug CMP
Lin Nana;Xing Zhe;Liu Yuling;Sun Ming;Liu Libin
Lin Nana;Xing Zhe;Liu Yuling;Sun Ming;Liu Libin
..............page:33-36,41
Effects of Alkaline Slurry on Low-k Dielectrics in CMP Process
Wang Liran;Xing Zhe;Liu Yuling;Hu Yi;Liu Xiaoyan
Wang Liran;Xing Zhe;Liu Yuling;Hu Yi;Liu Xiaoyan
..............page:29-32
Study on the Deep Submicron Radiation Hardened SRAM Circuit for RHBD Technologies
Wang Yiqi;Zhao Fazhan;Liu Mengxin;Lü Yinxue;Zhao Bohua;Han Zhengsheng
Wang Yiqi;Zhao Fazhan;Liu Mengxin;Lü Yinxue;Zhao Bohua;Han Zhengsheng
..............page:18-23
..............page:82,86-88
Influence of Silicon Substrate Parameters on Transmission Characteristics of Microstrip Bandpass Filters
Yan Junxi;Zhang Shuli;Peng Yufeng
Yan Junxi;Zhang Shuli;Peng Yufeng
..............page:47-50,67
Thermal Analysis of Flip Chip Ceramic Ball Grid Array Package
Yang Shaoqi;Xie Xiujuan;Luo Cheng;Zhou Lihua
Yang Shaoqi;Xie Xiujuan;Luo Cheng;Zhou Lihua
..............page:63-67
Design of DRO Based on CST and ADS
Chen Zhichao;Zhao Huichang
Chen Zhichao;Zhao Huichang
..............page:55-58
..............page:78-82
Design Method of Optical Filter Based on Semiconductor Micro-Ring Resonator
Zhang Bin;Zhang Shumei
Zhang Bin;Zhang Shumei
..............page:24-28
New Developments of Solid State Microwave, Millimeter-wave,THz Devices and Circuits (Continued)
Zhao Zhengping
Zhao Zhengping
..............page:1-8
5.8 GHz Linear InGaP/GaAs HBT MMIC Power Amplifier for W-LAN Applications
Zhang Ren;Yang Hongwen;Bao Jingfu;Yan Yuepeng
Zhang Ren;Yang Hongwen;Bao Jingfu;Yan Yuepeng
..............page:13-17,28
Performance Improvement of ZnTe Material by MBE with Low-Temperature Buffer Layers
Zhang Jiaqi;Zhao Jie;Liu Chao;Cui Lijie;Zeng Yiping
Zhang Jiaqi;Zhao Jie;Liu Chao;Cui Lijie;Zeng Yiping
..............page:37-41
Measurement of the Damage Cohstant for Bipolar Transistors and Estimation of Its Uncertainties
Bai Xiaoyan;Lin Dongsheng;Yang Shanchao;Li Da;Liu Yan;Jin Xiaoming;Wang Guizhen
Bai Xiaoyan;Lin Dongsheng;Yang Shanchao;Li Da;Liu Yan;Jin Xiaoming;Wang Guizhen
..............page:83-86
Measurement of Microbridges Mechanical Characteristics Based on Atomic Force Microscopy
Zheng Xianyi;Chen Huan;Fu Gang;Zeng Rongyao;Ding Xidong
Zheng Xianyi;Chen Huan;Fu Gang;Zeng Rongyao;Ding Xidong
..............page:68-73
Influence of the Major Projects on IC Industry Innovation
Song Zhaorui;Zheng Huiqiang;Zhao Yuhang;Zhao Jianzhong;Chen Qiang
Song Zhaorui;Zheng Huiqiang;Zhao Yuhang;Zhao Jianzhong;Chen Qiang
..............page:9-12