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Semiconductor Technology
1003-353X
2014 Issue 5
A 1.1 dB Noise Figure MMIC Low Noise Amplifier
Zheng Xinnian;Yang Hao;Zhang Haiying;Dai Zhiwei;Institute of Microelectronics;Chinese Academy of Sciences;
..............page:321-325
Design of the LVDS Driver Based on the SOI CMOS Process
Bu Shan;Zhou Yumei;Zhao Jianzhong;Liu Hainan;Institute of Microelectronics;Chinese Academy of Sciences;
..............page:326-329+334
Design of High Efficiency Primary Side Feedback Isolated LED Drive Circuit
Wang Wenjian;Zhejiang College of Business;
..............page:330-334
Design of the Radiation-Harden Sigma-Delta Modulator
Du Bin;Wang Ying;Chen Jie;Liu Yuntao;School of Information and Communication Engineering;Harbin Engineering University;Institute of Microelectronics;Chinese Academy of Sciences;
..............page:335-340+346
Design of Low Noise Integer-N Frequency Synthesizer Chip
Jiang Yonghong;Li Jin;The 13thResearch Institute;CETC;
..............page:341-346
Research and Fabrication of the Miniature Low Phase-Noise FBAR Voltage Controlled Oscillator
Yuan Biao;Guo Wensheng;The 13th Research Institute;CETC;
..............page:347-351
Super Junction LDMOS with Partial Charge Compensation Based on BCD Process
Wang Wenlian;Wang Yu;Jia Zhenhua;Key Laboratory of Instrumentation Science & Dynamic Measurement;Ministry of Education;North University of China;School of Instrument and Electronics;North University of China;
..............page:352-356
zheng zhong sheng ming
..............page:356
Research and Fabrication of L-Band GaN HEMT
Yan Rui;Yin Jun;Cui Yuxing;Zhang Lijiang;Fu Xingchang;Gao Xuebang;Wu Hongjiang;Cai Shujun;Yang Kewu;The 13th research Institute;CETC;
..............page:357-360+369
Design of High Brightness LED Chips with Reflective Electrode
Chen Caijia;Li Shen;Wang Jinghui;Li Xiaobo;The 13th Research Institute;CETC;Tonghui Electronics Corporation Co.;Ltd.;
..............page:361-364
Design and Manufacture of the 50-75 MHz 550 W Pulsed Power LDMOSFET
Deng Jianguo;Zhang Xiaofan;Liu Yingkun;Hu Shunxin;Sun Yanling;Lang Xiulan;The 13th Research Institute;CETC;
..............page:365-369
Study of Ultrathin Ni0.(86)Pt0.14 Silicide Film
Zhang Qingzhu;Gao Jianfeng;Xu Jing;Zhao Lichuan;Wu Cinan;Yan Jiang;College of Electronic and Information;Guizhou University;Key Laboratory of Microelectronics Devices & Integrated Technology;Institute of Microelectronics ofChinese Academy of Sciences;
..............page:370-376
SAPS Megasonic Cleaning Technology for High Aspect Ration TSV
Xue Kai;Chen Fuping;Zhang Xiaoyan;Zhang Mingchuan;Wang Hui;Yu Daquan;National Center for Advanced Packaging Co.;Ltd.;ACM Research Inc Co.;Ltd.;Institute of Microelectronics of the Chinese Academy of Sciences;
..............page:377-382
Application of the Ultrasonic Inspection Technology in Plastic Encapsulated Components
Cao Defeng;Wang Kunshu;Zhang Hui;Kong Zebin;Zhu Weimin;Xu Daojin;Shanghai Precision Metrology & Test Research Institute;
..............page:383-387+393
A Testing Method of the Electrical Performance Evaluation for GaN Material
Guo Enxiang;Guo Tianying;Xu Yongkuan;Key Laboratory of Functional Polymer Materials;Ministry of Education;College of Chemistry;Nankai University;The 46th Research Institute;CETC;
..............page:388-393