Investigation Status of the Substrate Materials and Epitaxial Technologies of GaN Power Devices in Foreign Countries
Fu Xingzhong;Zhao Jinxia;Cui Yuxing;Fu Xingchang;The 13th Research Institute;CETC;

..............page:881-888+959

Near-Threshold Standard Cell Library and Its Application in Wireless Sensor Network SoC
Sun Yinan;Liu Yongpan;Wang Zhibo;Yang Huazhong;Department of Electronic Engineering;Tsinghua University;

..............page:889-893+915

Development of GaAs 6-Bit Serial / Parallel Switch Driver Chip
Zhao Zirun;Chen Fengxia;The 13th Research Institute;CETC;

..............page:894-898

MEMS Gyroscope Driving Loop with Using Band-Pass Sigma-Delta Modulator
Xu Lei;Yang Yongjun;Ren Chen;Yang Liang;The 13th Research Institute;CETC;

..............page:899-903

An Improved Large-Signal Model of E-Mode GaN HEMT
Chen Qiufen;Li Wenjun;Liu Jun;Lu Haiyan;Han Chunlin;Key Laboratory for RF Circuits and Systems of Ministry of Education;Hangzhou Dianzi University;Science and Technology on Monolithic Integrated Circuits and Modules Laboratory;Nanjing Electronic Devices Institute;

..............page:904-910

ic china 2015 gong lv ban dao ti qi jian ji qi ke kao xing ji shu yan tao hui yuan man jie shu

..............page:910

A Novel Fast Recovery Diode with Low Anode Emission Efficiency
He Yanqiang;Liu Yueyang;Wu Di;Jin Rui;Wen Jialiang;Research Institute of New Electrical Materials and Microelectronics;State Grid Smart Grid Research Institute;

..............page:911-915

Design and Realization of a 30-2600 MHz Ultra-Broadband GaN Power Amplifier
Lu Yu;Chen Xiaojuan;Qian Kewei;Research Institute of Electron Science And Technology;University of Electronic Science and Technology of China;Institute of Microelectronics of Chinese Academy of Sciences;

..............page:916-920+929

Damage Mechanism of the New Antenna Effect during HDP Oxide Deposition Process
Huang Hongwei;Hang Tao;Li Ming;Shanghai Huahong Grace Semiconductor Manufacturing Corp.;School of Material Science and Engineering;Shanghai Jiao Tong University;

..............page:921-924

Study on Key Technology for Copper Pillar Bumping Production
Xue Xingtao;Meng Jin;Ho Chihching;Semiconductor Manufacturing International Corporation;

..............page:925-929

Influence of Acceptor Impurities on the Decay Process of Minority Carrier in p Type Monocrystalline Silicon
Zhao Yang;Wang Zelai;Zhang Peng;Lu Xiaodong;Wu Yuanqing;Zhang Yufeng;Zhou Tao;College of New Energy;Bohai University;

..............page:930-936

Properties of the AZO / Ag / AZO Transparent Conductive Films Prepared by Magnetron Sputtering Using Powder Targets
Liu Sining;Zhou Yanwen;Wu Chuan;Wu Fayu;School of Materials and Metallurgy;University of Science and Technology Liaoning;

..............page:937-943

Effect of Operating Current on the Endurance Characteristics of Phase Change Memory Cells
Huo Ruru;Cai Daolin;Chen Yifeng;Wang Yuchan;Wang Yueqing;Wei Hongyang;Wang Qing;Xia Yangyang;Chen Bangming;Song Zhitang;Shanghai Institute of Micro-System and Information Technology;Shanghaitech University;

..............page:944-949

ying fei ling tui chu 2edn eicedriver^tm mosfet qu dong qi

..............page:949

ying fei ling tui chu jia gu xing trenchstop^tm 5 s5 igbt

..............page:949

Research on DPA Experimental Process for Plastic Flip Chip
Zhang Danqun;Zhang Sujuan;Beihang University;

..............page:950-953

Application of Big Data Analysis on Semiconductor Reliability Research
Zhou Ke;Yin Binfeng;Gao Jinde;Wang Jihua;Shanghai Huali Microelectronics Corporation;

..............page:954-959

ban dao ti ji shu jian jie

..............page:960

2015 nian ban dao ti ji shu 40 juan zong mu ci

..............page:961-964