New Progress of the Microwave and Millimeter Wave GaN HEMT and MMIC(Continued)
Zhao Zhengping;China Electronics Technology Group Corporation;Science and Technology on ASIC Laboratory;

..............page:81-88

Optimized Design of Phase Noise for the Wideband LC VCO
Ding Lixiang;Wu Hongjiang;Lu Dongxu;Gu Jiang;Zhao Yongrui;The 13th Research Institute;CETC;

..............page:89-92+135

Design and Optimization of the Level Shifter Based on 40 nm CMOS Process
Zhou Huanhuan;Chen Lan;Yin Minghui;Zhang Weihua;Institute of Microelectronics;Chinese Academy of Science;

..............page:93-96+122

Design of the Thermal Protection Circuit Based on the Current Comparison
Chen Hao;Pang Yingjun;State Grid Wuhu Power Supply Company;

..............page:97-100

Thermal Performances Analysis of High Power LED Devices
Zhou Zichao;Zhao Lixia;Lu Pengzhi;Zhu Shichao;Wang Junxi;Zeng Yiping;Institute of Semiconductors;Chinese Academy of Sciences;

..............page:101-105

Effects of Process Parameters on the Voltage Withstanding Performance of Low Voltage TVS Devices
Chen Tian;Gu Jian;Zheng E;BCD Semiconductor Manufacturing Ltd;

..............page:106-111

diodes tui chu quan xin mosfet zha ji qu dong qi

..............page:111

Study on Optical Performance of High Luminous LED Filament Bulbs
Gong Sansan;Qin Huibin;Liu Dan;Institute of New Electron Device & Application;Hangzhou Dianzi University;

..............page:112-116

Design and Test of a Bistable Electromagnetic RF MEMS Switch
Li Huijuan;Yang Zijian;Sun Jian;Hao Changling;Yu Jifang;Beijing Aerospace Micromechanical Electronics Technology Institute;

..............page:117-122

Controllable Growth and Transfer of Carbon Nanotubes on Localized Pattern
Zhang Lei;Wang Junjie;Gong Qianming;Wu Cinan;Liu Zewen;College of Big Data and Information Engineering;Guizhou University;School of Materials Science and Engineering;Tsinghua University;State key laboratory of new ceramics and fine processing in Materials Department;Key Laboratory for Advanced Materials processing Technology;Institute of Microelectronics;Tsinghua University;

..............page:123-128

Junction Terminal Structure Technology of Ultra High Voltage Thyristor
Gao Shancheng;Li Chong;Wu Feiniao;Wu Tao;Yuan Yuan;He Shan;Xi’an Power Electronics Research Institute;

..............page:129-135

Thin Film Thermistor with Core-Shell Structure Material
Yan Jingyuan;Wu Fengci;Wang Tianyang;Li Wei;Liu Dongzhi;Zhou Xueqin;School of Chemical Engineering and Technology;Tianjin University;

..............page:136-141

Simulation and Validation of FBGA Package Warpage by Considering Viscoelastic Effect
Tan Lin;Chen Chuan;Li Jinrui;Cheng Xiyun;Wang Qian;Cai Jian;Institute of Microelectronics;Tsinghua University;Beijing Academy of Information Science & Technology;Tsinghua National Laboratory for Information Science and Technology;Tsinghua University;

..............page:142-147

fei si ka er tui chu 15 w qi jian rong de wu xian chong dian jie jue fang an

..............page:147

Failure Analysis of the Burnout in GaAs MMIC Based on Fault Tree Analysis
Yang Yang;Jia Dongming;Lin Gang;Qian Feng;Nanjing Electronic Device Institute;

..............page:148-151

Detection and Statistics for Cd S Wafer Micropipes by the Image Processing Technology
Chen Xin;The 46th Research Institute;CETC;

..............page:152-156

chan ye xin wen

..............page:157

ban dao ti ji shu gao yue

..............page:158

The IEEE 11^th International Conference on ASIC

..............page:159-160