Research Progress of Stretchable and Flexible Electronic Technology
Liu Xu;Lü Yanjun;Wang Longfei;Zhao Yinyan;School of Mechanical Engineering;Xi’an Aeronautical University;School of Mechanical and Precision Instrument Engineering;Xi’an University of Technology;

..............page:161-166+226

Research Progress of Low-Power Multi-Voltage Design Method for SoC
Qiu Pan;Qiao Shushan;Institute of Microelectronics;Chinese Academy of Sciences;

..............page:167-173+238

Design of Ultra Low Power SAR ADC
Ju Shuirong;Wei Tianyao;Zhu Zhangming;Department of Electronic Information;Jiangsu College of Information Technology;Institure of Microelectronics;Xidian University;

..............page:174-181

ban dao ti ji shu gao yue

..............page:181

Design of the Low Phase Noise QVCO Based on Superhamonic Injection Locking
Xu Yalan;Jiang Jinguang;Liu Jianghua;GNSS Research Center;Wuhan University;School of Telecom;Shenzhen Poly Technic;

..............page:182-187+204

A 6 Gbit / s Voltage Mode Transmitter with Low-Power and Low-Jitter
Lü Junsheng;Tian Ze;Shao Gang;Xi’an Aeronautics Computing Technique Research Institute;AVIC;

..............page:188-194+221

Design of Millimeter Wave Frequency Doubler MMIC Based on the Spiral Balun Structure
Chen Changyou;Wu Hongjiang;Zhao Yu;The 13th Research Institute;CETC;

..............page:195-200

Internally-Matched High Power Devices of GaN HEMT on C-Band
Lou Chen;Zhang Beibei;Yin Jun;Liu Zhen;Zhang Zhiguo;The 13thResearch Institute;CETC;Military Affairs Department of Air Force Headquarters;Science and Technology on ASIC Laboratory;

..............page:201-204

Formation Reason and Its Solution for the Gate Dielectvic Oxide Missing
Zhang Hongwei;Shanghai Huali Microelectronics Corporation;

..............page:205-210

A Novel Method of Optimizing the Alkaline Polishing Slurry Composition for Cu CMP
Fan Shiyan;Liu Yuling;Lin Kai;Shi Lukui;Liu Enhai;Institute of Microelectronics;Hebei University of Technology;School of Computer Science and Engineering;Hebei University of Technology;

..............page:211-216

Neutron Radiation Effects of AlGaN/GaN Heterostructures Materials
Gu Wenping;Quan Si;Zhang Lin;Xu Xiaobo;Liu Panzhi;School of Electronic and Control Engineering;Chang’an University;School of Microelectronics;Xidian University;

..............page:217-221

LED Packaging Technology of Encapsulation Carrier Fabricated by MEMS Technology
Xia Mingying;Cui Donghui;Nie Congwei;Jia Moran;Chen Junbo;Yang Yuntong;Hebei LEDE Electronic Co.;Ltd.;

..............page:222-226

New Evaluation Method for Chip Multi-Interconnection Film Adhesions
Zhang Guan;Chien Weiting Kary;Semiconductor Manufacturing International Cooperation;Semiconductor Manufacturing International Cooperation;

..............page:227-233

Reusable So C Function Verification Environment Based on UVM
Lü Yuda;Xie Xuesong;Zhang Xiaoling;College of Electronic Information & Control Engineering;Beijing University of Technology;

..............page:234-238

The IEEE 11^th International Conference on ASIC

..............page:239-240