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Semiconductor Technology
1003-353X
2015 Issue 4
Research Progress on Ge Photodetectors in Near Infrared Band
Ke Xingxing;Luo Jun;Zhao Chao;Wang Guilei;Key laboratory of Microelectronics devices and integrated technology;Institute of Microelectronics of Chinese Academy of Sciences;
..............page:241-249
Adaptive Voltage Scaling Technique Based on Critical Path Delay Monitoring
Qiu Pan;Qiao Shushan;Ling Kang;Sun Xiaolei;Zhao Huidong;Song Qiangguo;Institute of Microelectronics;Chinese Academy of Sciences;
..............page:250-254
High Linear Power Amplifier for IEEE 802. 11 b/g / n WLAN Applications
Jin Jie;Ai Baoli;Shi Jia;Cui Jie;College of Electrical and Electronic Engineering;Shanghai University of Engineering Science;Shanghai Advanced Research Institute;Chinese Academy of Sciences;
..............page:255-260
Stability Analysis and Design Optimization of 6-T CMOS SRAM Cells
Cai Jieming;Wei Jinghe;Liu Shiquan;Hu Shuigen;Yin Qin;The 58thResearch Institute;China Electronics Technology Group Corporation;
..............page:261-272
Design and Implementation of Anti-Cloning Technology for SRAM FPGA Based on Arbiter PUF
Ding Hao;Wang Jianye;Lü Fangxu;Air and Missile Defense Academy;Air Force Engineering University;
..............page:273-277
Effects of Electron Radiation on Al Ga N / Ga N HEMT Electrical Properties
Gu Wenping;Quan Si;Zhang Lin;Xu Xiaobo;Liu Panzhi;Yang Liyuan;School of Electronic and Control Engineering;Chang’an University;School of Microelectronics;Xidian University;
..............page:278-283
Creation and Application of Single Electron Transistor Model Based on PSpice
Xu Xiang;Ying Shiyan;Xiao Linrong;Nanhu College;Jiaxing University;College of Information Engineering;Zhejiang University of Technology;
..............page:284-288+307
Study of the Twin Crystallite Phenomenon in LEC-In P Crystal
Li Yuru;Li Xiaolan;Sun Tongnian;Sun Niefeng;The 13thResearch Institute;CETC;Science and Technology on ASIC Laboratory;
..............page:289-293
Novel Coaxial Mixed Carbon Nanotube Bundle Based Though-Silicon Vias
Wang Xingjun;Shi Lingfeng;Institute of Electronic CAD;Xidian University;Electronics & Information Institute;Shaanxi Institute of Technology;
..............page:294-301
Research on the Process for the Filled Via on Thin Film Substrates
Wang Heli;Shi Guanghua;Wang Zhihui;Chang Qingsong;Xu Da;The 13thResearch Institute;CETC;
..............page:302-307
Application of Si-Al Alloy on Circuit Assembly of Microwave Modules
Chen Yigang;Tian Feifei;Shao Dengyun;Dai Liqiang;Zhu Chao;Nanjing Electronic Devices Institute;
..............page:308-313
gao yue
..............page:313
Dielectric Breakdown Effect During Metal Electromigration Measurement
Yu Hewei;Yin Binfeng;Zhou Ke;Qian Yanni;Shanghai Huali Microelectronics Corporation;
..............page:314-318