1003-353X
2016 Issue 10
Research and Development of Reverse Blocking Technology for IGBT
Zhang Guangyin;Shen Qianxing;Zhang Xukun;Tian Xiaoli;Lu Shuojin;Zhu Yangjun;University of Chinese Academy of Sciences;Institute of Microeletronics;Chinese Academy of Sciences;Key Laboratory of Si Devices Technologies;Institute of Microeletronics;Chinese Academy of Sciences;Jiangsu R&D Center for Internet of Things;
Zhang Guangyin;Shen Qianxing;Zhang Xukun;Tian Xiaoli;Lu Shuojin;Zhu Yangjun;University of Chinese Academy of Sciences;Institute of Microeletronics;Chinese Academy of Sciences;Key Laboratory of Si Devices Technologies;Institute of Microeletronics;Chinese Academy of Sciences;Jiangsu R&D Center for Internet of Things;
..............page:721-729
Design of a 800 MS/s 10 bit DAC in 28 nm CMOS Technology
Man Liang;Du Zhankun;Ma Xiao;Liu Ke;Pang Xiaomin;Xiong Liwei;Institute of Microelectronics;Chinese Academy of Sciences;
Man Liang;Du Zhankun;Ma Xiao;Liu Ke;Pang Xiaomin;Xiong Liwei;Institute of Microelectronics;Chinese Academy of Sciences;
..............page:730-735
..............page:735
Design of a High-Efficiency Low Turn-on Voltage CMOS Rectifier Circuit
Cao Shihua;Zhang Huixi;An Kang;Qianjiang College;Hangzhou Normal University;
Cao Shihua;Zhang Huixi;An Kang;Qianjiang College;Hangzhou Normal University;
..............page:736-739+745
Research on an Advanced Semi-Insulation Structure Based on Silicon Substrate
Ma Kui;Yang Fashun;Department of Electronics;Guizhou University;Key Laboratory of Micro-Nano Technology of Guizhou Province;
Ma Kui;Yang Fashun;Department of Electronics;Guizhou University;Key Laboratory of Micro-Nano Technology of Guizhou Province;
..............page:740-745
Extraction for Characteristic Parameters of Amorphous-Silicon Thin-Film Transistors Based on Hspice Model
Yin Xiaowen;Yan Limin;Gong Luming;Microelectronics Research and Development Center;Shanghai University;
Yin Xiaowen;Yan Limin;Gong Luming;Microelectronics Research and Development Center;Shanghai University;
..............page:746-750
3d wei feng zhuang she pin / wei bo mo kuai
zhou biao ;
zhou biao ;
..............page:750
Development Overview of Carrier Enhancement Technology for IGBT
Shen Qianxing;Zhang Xukun;Zhang Guangyin;Yang Fei;Tan Ji;Tian Xiaoli;Lu Shuojin;Zhu Yangjun;Jiangsu R&D Center for Internet of Things;University of Chinese Academy of Sciences;Chinese Academy of Sciences;Key Laboratory of Si Devices Technologies;Institute of Microdectronics;Chinese Academy of Sciences;
Shen Qianxing;Zhang Xukun;Zhang Guangyin;Yang Fei;Tan Ji;Tian Xiaoli;Lu Shuojin;Zhu Yangjun;Jiangsu R&D Center for Internet of Things;University of Chinese Academy of Sciences;Chinese Academy of Sciences;Key Laboratory of Si Devices Technologies;Institute of Microdectronics;Chinese Academy of Sciences;
..............page:751-758+778
InGaAs/InP Avalanche Photodiodes for Optical Communication
Yin Shunzheng;Qi Lifang;Zhao Yonglin;Zhang Yuqian;Che Xianghui;Zhang Yu;The 13th Research Institute;CETC;
Yin Shunzheng;Qi Lifang;Zhao Yonglin;Zhang Yuqian;Che Xianghui;Zhang Yu;The 13th Research Institute;CETC;
..............page:759-763
Applications of Pre-Amorphization and Carbon Co-Implantation in Ultra Shallow Junction Technology
Xu Xiaoyan;Chen Wenjie;Liu Xinglong;Institute of Microelectronics;Peking University;
Xu Xiaoyan;Chen Wenjie;Liu Xinglong;Institute of Microelectronics;Peking University;
..............page:764-768
Influence of Operation Algorithm on RRAM Reliability Under Different Process
Wang Bo;Yang Jianguo;Lin Yinyin;State Key Laboratory of ASIC and System;Fudan University;
Wang Bo;Yang Jianguo;Lin Yinyin;State Key Laboratory of ASIC and System;Fudan University;
..............page:769-773+788
Real-Time Measurement of the Transient Temperature Rise of the Fast Recovery Diode by the Non-Switched Electrical Method
Jin Rui;Ren Yunxiang;Guo Chunsheng;Feng Shiwei;Su Ya;Department of New Electrical Materials and Microelectronics;State Grid Smart Grid Research Institute;College of Electronic Information and Control Engineering;Beijing University of Technology;
Jin Rui;Ren Yunxiang;Guo Chunsheng;Feng Shiwei;Su Ya;Department of New Electrical Materials and Microelectronics;State Grid Smart Grid Research Institute;College of Electronic Information and Control Engineering;Beijing University of Technology;
..............page:774-778
A High Speed Data Acquisition of High Temperature Logging Instrument Based on System in Package
Huang Lin;Meng Xianglong;Zhang Jiawei;Cheng Jingjing;Well-Tech R&D Institutes;China Oilfield Service Limited;School of Automation;Huazhong University of Science and Technology;
Huang Lin;Meng Xianglong;Zhang Jiawei;Cheng Jingjing;Well-Tech R&D Institutes;China Oilfield Service Limited;School of Automation;Huazhong University of Science and Technology;
..............page:779-783
Two Methods for Real-Time and Multi-Spots IR Drop Detection
Shen Yueming;Xue Xiaoyong;Lin Yinyin;State Key Laboratory of ASIC and System;Fudan University;
Shen Yueming;Xue Xiaoyong;Lin Yinyin;State Key Laboratory of ASIC and System;Fudan University;
..............page:784-788
Hardware Trojan Detection Technology Based on the Self-Referencing Approach
Wang Qiao;Yu Zongguang;Zhou Yu;Wang Lin;Lei Shulan;School of Io T Engineering;Jiangnan Univerisity;The 58th Research Institute;CETC;School of Io T Engineering;
Wang Qiao;Yu Zongguang;Zhou Yu;Wang Lin;Lei Shulan;School of Io T Engineering;Jiangnan Univerisity;The 58th Research Institute;CETC;School of Io T Engineering;
..............page:789-793+799
Failure Analysis Method for New Designed Wafer Electrical Test Pattern
Hong Haiyan;Xu Li;Zhou Hao;Xu Haitao;CSMC Technologies Corporation;
Hong Haiyan;Xu Li;Zhou Hao;Xu Haitao;CSMC Technologies Corporation;
..............page:794-799
zhong guo dian zi ke ji ji tuan gong si di shi san yan jiu suo ji guang qi chan pin tui jie
liu xiao wen ;
liu xiao wen ;
..............page:799
..............page:800