Analysis of the Reliability Difference Between IGBT Modules and Press-Pack IGBTs
Deng Erping;Zhang Jingwei;Li Yaosheng;Jin Rui;Zhao Zhibin;Huang Yongzhang;State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources;North China Electric Power University;State Grid Global Energy Interconnection Research Institute;

..............page:801-810+815

Design of Wideband Voltage-Controlled Oscillator Based on the Variable Fully Differential Inductor
He Zhangqing;Ren Zhixiong;Wan Xiangkui;Li Fengcong;Hubei Collaborative Innovation Center for High-Efficiency Utilization of Solar Energy;Hubei University of Technology;School of Electrical and Electronic Engineering;Hubei University of Technology;

..............page:811-815

Design of a Low-Noise Adjustable LDO for Low-Phase-Noise LC Voltage-Controlled Oscillators
Liang Longxue;Shi Yapan;Gu Jiang;Lu Dongxu;School of Electronic and Information Engineering;Lanzhou Jiaotong University;The 13th Research Institute;CETC;

..............page:816-821

Optimization Design of the Chip Structure for Current Distribution in the GaN-Based LED
Luo Jiansheng;Chai Guangyue;Liu Wen;Liu Zhihui;College of Optoelectronic Engineering;Shenzhen University;

..............page:822-826+880

Design and Fabrication of the 10 Gbit/s-FP Laser Diode Chip
Zhang Xiaoguang;Zhao Run;Cao Chentao;Che Xianghui;Li Qingwei;The 13th Research Institute;CETC;

..............page:827-830+874

Edge-Polishing Technology of the Large-Size Silicon Wafer
Li Yaodong;Ku Liming;Liu Bin;Wang Xin;Zheng Qi;Liu Hongyan;GRINM Semiconductor Materials Co.;Ltd.;General Research Institute for Nonferrous Metals;

..............page:831-835

zhong guo dian zi ke ji ji tuan gong si yan zhi chu shi mo xi di zao sheng fang da qi dan pian ji cheng dian lu
wei cui ;

..............page:835

Influence of High-Purity Silica Barrier Layers on Multicrystalline Silicon Ingots and Light Induced Degradation of Modules
Niu Xiaolong;Qiao Song;Zhang Limo;Xia Xinzhong;Gao Wenkuan;Ni Jianxiong;State Key Laboratory of Photovoltaic Materials & Technology;Yingli Energy Co.;Ltd.;

..............page:836-841

Annealing Process of Ni/Ag/Au Based Reflection Layer of LED Flip Chips
Zhou Zhaoxu;Zhang Baoguo;Wang Jinghui;Zhen Zhenzhen;Li Xiaobo;Pan Baichen;School of Electronic Information Engineering;Hebei University of Technology;Tianjin Key Laboratory of Electronic Materials and Devices;Hebei Tonghui Electronics Technology Co.;Ltd.;

..............page:842-846

Effects of the Melt Temperature on the Synthesis of InP
Yang Jianye;Wang Yang;Li Shuai;Li Xiaolan;Sun Niefeng;The 13th Research Institute;CETC;Science and Technology on ASIC Laboratory;The 13th Research Institute;CETC;

..............page:847-851

Effects of the Temperature on the Growth of Graphene on Silicon Substrate
Liu Qingbin;Yu Cui;He Zezhao;Wang Jingjing;Li Jia;Lu Weili;Feng Zhihong;The 13th Research Institute;CETC;Science and Technology on ASIC Laboratory;The 13th Research Institute;CETC;

..............page:852-856

Development of Damage-Free Single Wafer Megasonic Cleaning Device
Teng Yu;Chen Jie;Feng Xiaomin;Liu Wei;Liu Xiaoyan;Wu Yi;Beijing Sevenstar Electronics Co.;Ltd.;

..............page:857-863

13pg1821m xing gao zhong pin zhai mai chong shu chu mo kuai
zuo wei ;

..............page:863

Design of Parallel Test System for a Low-Frequency RFID Wafer
Du Ping;Jing Weiping;Jiangsu Key Laboratory of ASIC Design;Nantong University;

..............page:864-868

Influence of DLTS Test Conditions on the Characterization of Deep Energy Levels at Different Level Positions
Huang Jin;Zheng Qinghong;Fujian Institute of Research on the Structure of Matter;Chinese Academy of Sciences;College of Materials Engineering;Fujian Agriculture and Forestry University;

..............page:869-874

Application of the Laser Voltage Probing and Imaging Technology in Failure Analysis
Chen Liqing;Zhao Ruihao;Sun Mingsheng;Lin Guangqi;Su Ke;Hu Qiyu;Jia Hui;Semiconductor Manufacturing International Corporation;School of Software & Microelectronics;Peking University;

..............page:875-880