Progress in Photoconductive Ultraviolet GaN Detector
liu yunyan; zhang deheng; wang qingpu (physics department; shandong university; jinan 250100)

..............page:16-20

Thick Film Material and Process Applied in Microwave and RF Circuits
wang zhihui (the 13th institute(electronics); shijiazhuang 050051)

..............page:21-29

Design of 3V/5V Combined Standard Cell Chip
ju shuirong (mos ic design institute; huajing electronics corporation; wuxi 214061)

..............page:37-39,44

Research of GaAs SCFL Circuit
liao bin; luo siwei; wu hongjiang (the 13th institute(electronics); shijiazhuang 050051)

..............page:45-49

SRD High-Order Multiplier Fabrication
zhang guangxian; bai xiwei (the 13th institute(electronics); shijiazhuang 050051)

..............page:50-52

Low-k- Dielectric Materials and Related Technologies for VLSI Interconnect System
song dengyuan; wang yongqing; sun rongxia (college of electronic & information engineering; hebei university; baoding 071002) zhang quangui (electronic industry bureau of hebei province; shijiazhuang 050002)

..............page:8-12

Design of the Three-Zone-Temperature for HPLEC SI GaAs Single Crystal Growth
song qunhou; mao yuguo (the 55th institute(electronics); nanjing 210016)

..............page:53-54

Theory and Method of Silicon Wafer Cleaning
liu chuanjun; zhao quan; liu chunxiang; yang hongxing (the 46th institute(electronics); tianjin 300220)

..............page:30-36

xiu si gong si fa she shi jie zui da tong xin wei xing
li xiu qing

..............page:49

Multi Medium Computer Aided Instruction System for Integrated Circuit Manufacturing Technique
li huijun; zhang xin; hao xiutian; chen huikai (shandong university of technology; jinan 250061)

..............page:55-57

gan lan guang - zi wai guang guang dian zi cai liao yu qi jian de yan jiu xian zhuang
li xiu qing

..............page:58-64

Solder Bump Flip-Chip Bonding Technology
li bo; wang hai; wang dong; wu guishan (the 13th institute(electronics); shijiazhuang 050051)

..............page:40-44

Techniques of SiC Semiconductor Materials and Devices
yang kewu; pan jing (the 13th institute(electronics); shijiazhuang 050051) yang yintang (xi an university of science and technology; xi an 710071)

..............page:13-15,29

Damage Mechanism Analysis for Plastic Encapsulated Microelectronics Devices
wang changhe (the 13th institute(electronics); shijiazhuang 050051)

..............page:1-7,29