Study on the fabrication of nanometer-sized metal-semiconductor interfaces by in situ electrochemical process
fu xiu-li; wang tai-hong(institute of physics; chinese academy of sciences; beijing100080; china)

..............page:5-9,44

Study on double-base linear sensitive ceramics
wang meng-kui (department of physics; jinzhou normal college; jinzhou121003; china)

..............page:21-24

The effects on NASICON materials by using chelator
zhu qi-feng; qiu fa-bin; quan yu-jun; xu bao-kun (institute of electronic science and engineering; jilin university; changchun130023; china)

..............page:18-20

Effects on exciton confinement and energy transfer in nano-line of low dimension polymer
kong xiang-gui ; wang xin; an li-min; shan gui-ye; hu bin; jin chang-qing (open laboratory of excited state processes; changchun institute of optics and fine mechanics&physics; the chinese academy of sciences; changchun130021; china)

..............page:14-17,35

Study on flash memory device
ou wen (microelectronics research&development center; the chinese academy of sciences; beijing100029; china)

..............page:10-13

The ITRS 2001and reduction of the chip feature size
weng shou-song (wuxi luo te electronic co.; ltd.; wuxi214002; china)

..............page:1-4

A bulk-silicon micro-accelerometer with comb differential-capacitance
he hong-tao; xu yong-qing; yang yong-jun; lu miao; zheng feng; lin hai-feng (hebei semiconductor research institute(hsri ); shijiazhuang050051; china)

..............page:25-28

Proximity effects during mask fabrication
du jing-lei 1 ; shi rui-ying 2 ; cui zheng 3 ; guo yong-kang 1(1.physics department ; sichuan university; chengdu610064; china; 2.microelectronics r&d center; the chinese academy of scienes; beijing100029; china; 3.rutherford appleton laboratory; chilton; didcot; oxon ox110qx; uk)

..............page:36-40

A MEMS switch for isolation amplifier application
xu ai-dong; guo he-jun; lu miao; hu xiao-dong; zou xue-feng (the13th electronic research institute; cetc; shijiazhuang050051; china)

..............page:29-35

ye jie kuai xun

..............page:45-47

Application and development of etch equipment and process in semi conductor superfine line manufacturing
wang si-yu; kang jian (shenzhen si semiconductor co.; ltd.; shenzhen518029; china)

..............page:41-44