Hot embossing lithography
chen fang; gao hong-jun; liu zhong-fan (college of chemistry and molecular engineering; peking university; beijing 100871; china)
Research and progress of the interfical stresses of silicon direct bonding
chen xin-an1; 2; huang qing-an1; li wei-hua1; liu su2(1.key laboratory of mems of ministry of education; southeast university; nanjing 210096; china; 2.institute of microelectronics; lanzhou university; lanzhou 730000; china)