Finite element analysis of bimorph thermal actuators
jiang yan-feng ; zhang xiao-bo (key lab of field bus technology&automation; microelectronic center; college of information engineering; north china university of technology; beijing100041; china)

..............page:29-31,43

Technologies used in preparation and test of low dielectric constant materials for VLSI
wen liang; wang jia-you; yang yin-tang (institute of microelectronics; xidian university; xi an710071; china)

..............page:39-43

Nanoelectronics
guo shu-tian (the24th research institute; cetc; chongqing400060; china)

..............page:6-13,24

ye jie kuai xun

..............page:47-46

Spintronics and spin electric devices
chen pei-yi ; deng ning (institute of microelectronics; tsinghua university; beijing100084; china)

..............page:1-5,20

Design of a high-resolution capacitive microaccelerometer
zhang shao-feng ; chen hua-ling (college of mechanical engineering; xi an jiaotong university; xi an710049; china)

..............page:32-36

ming ci shu yu shi yi biao mian xiao ying

..............page:38

GaN bizarre surface grown on silicon (111)substrate by the hot wall chemical vapor deposition
sun zhen-cui; cao wen-tian; wei qin-qin; xue cheng-shan; wang shu-yun (institute of physics and electronics; shandong normal university; ji zuo nan250014; china)

..............page:17-20

Using DSP to achieve image acquisition and processing in the bottom side alignment system
ke xue ; luo zheng-quan (institude of optics and electronics; chinese academic of sciences; chengdu610209; china)

..............page:44-46

gui zhou hang tian na mi ke ji you xian ze ren gong si

..............page:48

Ferroelectric material in MEMS
guo dong-yun 1 ; wang yun-bo 1 ; fu cheng-ju 2 ; yu jun 1(1.huazhong university of science and technology; wuhan430074; china; 2.wuhan university of technology; wuhan430070; china)

..............page:25-28

Research of the capacitive force micro-sensor
liu jing-chun 1 ; deng yong-he 2 ; li yu-cong 2(1.dept of physics and electronic eng.jishou university; jishou416000; china; 2.dept of mathematics and physics; hunan institute of engineering; xiangtan411100; china)

..............page:37-38

The Cu interconnection and its relevant technology
weng shou-song (wuxi luo te electronic co.; ltd; wuxi214002; china)

..............page:14-16,36

ming ci shu yu shi yi xiao chi cun xiao ying

..............page:28

Preparation of(Y_2O_3·CaO)-ZrO_2 ultrafine powders and influence of conditions on particle size
chen ru-fen; song xiu-qin (department of chemistry; hebei normal university; shijiazhuang050016; china)

..............page:21-24