..............page:123-126
..............page:119-122
..............page:127-128
ECMP of Cu in the Preparation Process of ULSI
chu xiangfeng1; bai linshan1; li yuzhuo1; 2(1.school of chemistry and chemical engineering; anhui university of technology; maanshan 243002; china; 2.center of advanced materials processing; department of chemistry; clarkson university; new york 13699; usa)
..............page:115-118
..............page:70-74,90
..............page:79-83,98
..............page:99-103,114
XRD Technique in the Research of Thin Film Materials
zhou yuanjun; xie zili; zhang rong; liu bin; li yi; zhang zeng; fu deyi; xiu xiangqian; han ping; gu shulin; zheng youdou(jiangsu provincial key laboratory of advanced photonic and electronic materials; department of physics; nanjing university; nanjing 210093; china)
..............page:108-114
..............page:104-107
Research Status of Microvalves in Microfluidic Systems
xiao lijuna; b; c; chen xianga; b; c; wang penga; b; c; li yiguia; b; c; chen dia; b; c(a.institute of micro and nano science and technology; b.national key laboratory of nano/micro fabrication technology; c.key laboratory for thin film and microfabrication of minstry of education; shanghai jiaotong university; shanghai 200240; china)
..............page:91-98