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1001-5507
2009 Issue 3
Light Controlled MOBILE with the RTD/HPT Structure
guo weilian(1.school of information and communication engineering; tianjin polytechnic university; tianjin 300160; china; 2.national key laboratory of asic; shijiazhuang 050051; china; 3.school of electronic information engineering; tianjin university; tianjin 300072; china)
..............page:141-147
Mechanical Topology Optimization for Low Threshold Voltage Capacitive RF MEMS Switches
gao yang1; 2; liu jia3a; bai zhuchuan3b; liu tingting3a; chen yingduan3a(1.institute of electronic engineering; china academy of engineering physics; mianyang 621900; china; 2.key laboratory of optoelectronic technology and system; chongqing university; chongqing 400044; china; 3.a.school of information engineering; b.school of manufacturing science and engineering; southwest university of science and technology; mianyang 621010; china)
..............page:160-165
Calibration Methods for Elastic Constant Kn of a SPM Cantilever
yan yongda1; yin dayong2; sun tao1; fei weidong1; dong shen1 (1.center for precision engineering; harbin institute of technology; harbin 150001; china; 2.satellite environment engineering institute; beijing 100094; china)
..............page:174-180,185
shi chang
wang shu hua ; wang ling
..............page:191-192
Trends of Lithography Technology Based on Decreasing of the Feature Size
sun lei; dai qingyuan; qiao gaoshuai; wu rixin(research institute of micro/nano science and technology; shanghai jiao tong university; shanghai 200240; china)
..............page:186-190
Molecular Dynamic Simulation of Welding Process Between Two Single-Walled Carbon Nanotubes in Axial Direction
yin haihong1; song changqing1; zhu haifeng1; wang kunchi1; tang min2(1.college of electronics and informatics; nantong university; nantong 226019; china; 2.physical department; jiangsu institute of education; nanjing 210013; china)
..............page:148-153
Research Progress on the Silicon Based Light Emitting
liu wei1; niu pingjuan1; li xiaoyun1; guo weilian1; 2(1.school of information and communication engineering; tianjin polytechnic university; tianjin 300160; china; 2.school of electronic information engineering; tianjin university; tianjin 300072; china)
..............page:154-159
Influence of Thermal Effect on Magnetic Switching Driven by Current
dong hao; chen peiyi; zhang lei; ren min; deng ning(a.institute of microelectronics; b.tsinghua national laboratory for information science and technology(in preparation); c.department of micro-nano electronics; tsinghua university; beijing 100084; china)
..............page:129-133
Resistive Switching Mechanisms for Nonvolatile Resistive Random Access Memory Based on I-V Characteristic
li yingtao1; 2; liu ming1; long shibing1; liu qi1; 3; zhang sen1; wang yan1; 2; zuo qingyun1; wang qin1; hu yuan1; liu su2(1.laboratory of nano-fabrication and novel devices integrated technology; institute of microelectronics; chinese academy of sciences; beijing 100029; china; 2.institute of microelectronics; school of physical science and technology; lanzhou university; lanzhou 730000; china; 3.school of electronic science and technology; anhui university; hefei 230039; china)
..............page:134-140,153
Simulation and Experiment of a Traveling Wave Electroosmotic Pumping Microflow
yang hukun; jiang hongyuan; shang dong; yan hui(school of mechatronics engineering; harbin institute of technology; harbin 150001; china)
..............page:166-169
Digital Gray-Tone Projection Lithography
zhao lixin; yan wei; wang jian; hu song; tang xiaoping; wang zhaozhi; wang shurong; zhang zhengrong; zhang yudong(institute of optics and electronics; chinese academy of sciences; chengdu 610209; china)
..............page:181-185
chan pin
wang shu hua ; wang ling
..............page:192
Novel Dual-Band Power Amplifier Based on RF MEMS Switches
ye liuxiao1; 2; xu gaobin1; cao rui2(1.micro electromechanical system research center of engineering and technology of anhui province; department of applied physics; hefei university of technology; hefei 230009; china; 2.microsystems research center of east china research institute electronic engineering; hefei 230031; china)
..............page:170-173