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Semiconductor Information
1001-5507
2012 Issue 11
Effects of Alkaline Slurry on CMP Selectivity of Cu and Ta
Huang Tinghe1;Liu Yuling1;Hu Yi1;Bao Jie2;Zheng Weiyan1
..............page:755-761
Influences of the Annealing Temperature on Resistance Temperature Characteristics of Mn-Co-Ni-O NTC Thin Films
Li Zhangheng;Yang Chuanren;Zhang Jihua;Chen Hongwei;Zhao Qiang
..............page:762-766
Effects of Cu or Sn and Fe Co-Doping on the Morphology and Magnetism of ZnO Crystals
Liu Chao1;Liu Jiwen1;Jia Liyun1;Zhang Ligang1;Wei Zhiren2
..............page:726-731
Design and Research Progress of the Adder Implemented with the QCA
Wang Hui;Xie Guangjun;Huang Wenlong
..............page:709-715,725
Influences of External Factors on the Electrically Induced Patterning Technique by Numerical Simulation
Tian Hongmiao;Shao Jinyou;Ding Yucheng;Li Xin;Li Xiangming
..............page:736-742
Modeling and Analysis of the Air Damping for Perforated Structures in MEMS Gyroscopes
Li Xiguanga;Li Mengweia;b;Wang Lia;b;Cui Mina;Liu Juna;b
..............page:749-754,766
Research and Application Progress on the Atomic Layer Deposition technology
Qiu Hongbo1;2;3;Liu Bangwu2;3;Xia Yang2;3;Li Huiqi1;Chen Bo2;3; Li Chaobo2;3;Wan Jun2;3;Li Yong1;2;3
..............page:701-708,731
High-Precision Calibration Method for the Error of MEMS Accelerometers
Wang Xiaochun;Li Rongbing;Hang Yijun;Sun Yongrong
..............page:743-748
Study on Preparation and Electrical Properties of a New Kind of NTC Thermistor Material with High B Value
Zhang Lu1;2;3;Kang Xueya1;3;Dou Junqing1;2;3;Han Ying1;3
..............page:732-735,761
Research on GaN-Based HFET Power Electronic Devices
Jia Lifang;Fan Zhongchao;Yan Wei;Yang Fuhua;
..............page:716-725