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Semiconductor Information
1001-5507
2012 Issue 5
Noise Depression for the Parallel Capacitive of MEMS Resonators
Tang Meng;Feng Ming;Cheng XinHong
..............page:318-322
guo ji shi dian
wang ling
..............page:350-352
Research on the Polyimide Micro-Etching Process
Dong Shuancheng;Yuan Weizheng;Ma Binghe;Deng Jinjun;Hao Ripeng
..............page:323-327
Application of the Spacer Technology in the PCRAM
Fu Yingchun;Wang Xiaofeng;Zhang Jiayong;Xu Xiaona; Ma Huili;Ji An;Yang Fuhua
..............page:328-335
Effect of Back Pressure on the Uniformity of Wafer Thickness in the Cu CMP Process
Chuan Liwei;Liu Yuling;Wang Chenwei
..............page:340-344
Study of the Dielectrostriction Coefficient of Thermal SiO2 Subjected to the Uniaxial Stress
Dong Weijie1a;Chen Xiaowei1a;Cui Yan1b;Huang Jianqiu2
..............page:302-305,312
Application of Wafer-Level Vacuum Packaging Technology for MEMS Gyroscopes
Yang Jing;Zhang Fuqiang
..............page:345-349
Structure Design and Simulation of the MEMS Gyroscope Based on Leverage Mechanism
Li Xiaoqing;Chang Honglong;Jiao Wenlong;Xie Jianbing;Yuan Guangmin
..............page:313-317
Nanosecond Laser Electrochemical Compound Masking Microfabrication
Wang Yaomin;Zhang Zhaoyang;Li Zhongyang;Mao Weiping
..............page:336-339,349
Latest Experimental Research Progress on Organic Field-Effect Transistors
Xie Jipeng1a;2;Ma Chaozhu1a;Yang Ting1a;Yao Bo1a;Peng Yingquan1a;1b
..............page:291-301
Development Status and Key Technologies of the Hybrid Insect MEMS
Feng Qingjuan;Hu Kaibo;Zhu Zhiyuan
..............page:285-290,301