Research Progresses of GaN-Based Grating External Cavity Semiconductor Lasers
Yao Zhenyu;LüXueqin;Zhang Baoping;Department of Physics;Xiamen University;Pen-Tung Sah Institute of Micro-Nano Science and Technology;Xiamen University;Department of Electronic Engineering;Xiamen University;

..............page:609-614+622

Atomic Structural Model of the Si/SiO₂ Interface
Du Longhuan;Rong Limei;Du Jiangfeng;Yu Qingwei;Zheng Xiaoming;School of Microelectronics and Solid-State Electronics;Univerity of Electronic Science and Technology of China;

..............page:615-622

Design of the High Isolation Step Structure MEMS Switch
Ling Yuan;Bao Jingfu;Li Xinyi;Huang Yulin;Kou Bo;Zhao Xinghai;School of Electronic Engineering;University of Electronic Science and Technology of China;Electronic Engineering Institute;China academy of engineering physics;

..............page:623-628

X-Band Microstrip Antennas with High Resistivity Silicon Substrates
Hong Quan;Liu Xiaoming;Chen Huanhui;Deng Zhenlei;Zhu Zhonggan;School of Mechatronics Engineering;University of Electronic Science and Technology of China;

..............page:629-634

Fabrication Method of the Microfluidic Chip Based on the Numerical Control Carving Machine
Zhang Xiaolong;Gao Hongwei;Jiao Niandong;Liu Lianqing;Institute of Information Science and Engineering;Shenyang Ligong University;State Key Laboratory of Robotics;Shenyang Institute of Automation;Chinese Academy of Sciences;

..............page:635-638+661

Charge Transfer and Nanostructure Formation in Chemical Etching of Silicon
Fan Shuxiao;Ning Zhichao;College of Science;Changchun University of Science and Technology;

..............page:639-645

Fabrication of the Three-Dimensional Micro Lens Array by Reverse Water Bath Tilt-Exposure Method
Wu Shujuan;Zhang Binzhen;Wang Wei;Wang Chunshui;Science and Technology on Electronic Test & Measurement Laboratory;North University of China;Key Laboratory of Instrumentation Science & Dynamic Measurement;Ministry of Education;North University of China;

..............page:646-651

wei na dian zi ji shu jian jie

..............page:651

Problem of the Copper Loss for Barrier Layer CMP
Wang Weichao;Wang Shengli;Liu Yuling;Wang Chenwei;Yue Hongwei;Gao Jiaojiao;Ma Suohui;Institute of Microelectronic;Hebei University of Technology;

..............page:652-655+666

Research Progresses of Multiple Patterning Techniques
Hong Zhongshan;Wu Hanming;Semiconductor Manufacturing International Corporation;

..............page:656-661

Fabrication of Graphene Nanomeshes by the Femtosecond Four-Beam Interference Technique
Li Yan;Chen Hui;Dai Kejie;High-Voltage Intelligent Switch Engineering Research Center;College of Electric &Information Engineering;Pingdingshan University;

..............page:662-666

Effects of the Alkali Slurry on Ti/Cu Removal Rates of the TSV Barrier Layer
Ma Suohui;Wang Shengli;Liu Yuling;Wang Chenwei;Yang Yan;Institute of Microelectronics;Hebei University of Technology;School of Information Engineering;Hebei University of Technology;

..............page:667-670

Technology of ZnTe Crystal Growth by PVT
Li Hui;Xu Yongkuan;Cheng Hongjuan;Shi Yuezeng;Hao Jianmin;The 46th Research Institute;CECT;

..............page:671-674

ji shu
wang ling ;

..............page:675-676