Home | Survey | Payment| Talks & Presentations | Job Opportunities
Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Semiconductor Information
1001-5507
2013 Issue 12
Analysis of the Stray Charge on the Majority Using the Probabilistic Model
Chen Xiangye;Cai Li;Wang Sen;Zhang Mingliang;Qin Tao;College of Science;Air Force Engineering University;
..............page:745-750+757
Memristor as the Fourth Basic Circuit Element and Its Applications
Zhang Yonghua;Zheng Fanglin;Xiong Dayuan;Wang Yongliang;Institute of Microelectronics Circuit and System;East China Normal University;Research Institute of Micro/Nano Science and Technology;Shanghai Jiao Tong University;
..............page:751-757
Morphology-Control of Cu2S Nanostructures by Hydrothermal Synthesis and Their Field Emission Properties
Song Changqing;Yin Haihong;Li Shouchuan;School of Electronics and Information;Nantong University;Key Laboratory of Polar Materials and Devices;Department of Electronic Engineering;East China Normal University;
..............page:758-764
Fabrication of GaN Nanopillar Arrays Using Self-Assembly Ni Nanodots as the Mask
Wu Yuxin;Cao Yuping;School of Information Technology;Shandong Women’s University;College of Science;Qilu University of Technology;
..............page:765-769
Structure Design and Analysis of the Micro-Vibration Energy Harvester Based on the Diamagnetic Levitation
Su Liushuai;Su Yufeng;School of Mechanical Engineering;Zhengzhou University;
..............page:770-775+780
Oil-Filled High-Temperature and High-Pressure Composite Sensors of Pressure and Temperature
Tian Lei;Liu Zhihui;Li Haibo;Yin Yanzhao;The 49th Research Institute;CETC;
..............page:776-780
Influence of the Sputtering Power on ZnO Thin Films
Ren Guangyuan;Yang Ruixia;Wang Ru;Yang Tiantian;Wang Xiaocui;Tianjin Key Laboratory of Electronic Materials and Devices;Hebei University of Technology;Institute of Microeletronics;Hebei University of Technology;
..............page:781-784+788
Stability of the Weak Alkaline More Hydroxyl Amine Agent in the Slurry
Cai Ting;Liu Yuling;Wang Chenwei;Chen Rui;Gao Jiaojiao;Institute of Microelectronics;Hebei University of Technology;
..............page:785-788
Application of the Electrochemical Preparation of a New Oxidation Solution in the Copper CMP
Zhen Jiali;Tan Baimei;Gao Baohong;Guo Qian;Zhao Yunhe;Institute of Microelectronics;Hebei University of Technology;
..............page:789-792+797
Chemical Mechanical Planarization Uniformity of Multilayer Copper Pattern Wafers for GSI
Cao Yang;Liu Yuling;Wang Chenwei;Institute of Microelectronics;Hebei University of Technology;
..............page:793-797
Removal of Copper-BTA Under the Alkaline Condition
Yang Haokun;Liu Yuling;Wang Chenwei;Zhang Hongyuan;Hong Jiao;Sun Mingbin;Institute of Microelectronics;Hebei University of Technology;
..............page:798-802
Analysis of the Causes of the Time-Dependent Haze on the Polished Silicon Wafer Surface
Liu Yunxia;Shi Xunda;Li Junfeng;Lin Lin;Zhao Jing;Liu Zhuo;GRINM Semiconductor Materials Co.;Ltd.;
..............page:803-806
guo ji shi dian
wang ling ;
..............page:807-809