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Semiconductor Information
1001-5507
2015 Issue 6
Inorganic Stretchable,Flexible Electronic Interconnect Structure and Its Mechanical Properties
Lin Hua;Pan Kailin;Chen Renzhang;Wei Na;Electromechanical Engineering College;Guilin University of Electronic Technology;
..............page:341-347
ZnCdS/CdxZn1-xSeyS1-y Quantum Dot Quantum Well and Organic-Inorganic LEDs
Li Yanpei;Liu Kong;Lu Shudi;Kou Yanlei;Yue Shizhong;Key Laboratory of Semiconductor Materials Science;Institute of Semiconductors;Chinese Academy of Sciences;
..............page:348-354+395
Properties of Mn2+-Doped CdS Quantum Dot Sensitized Solar Cells
Lü Qikun;Gu Xiuquan;School of Materials Science and Engineering;China University of Mining and Technology;
..............page:355-358
Structurally Tailored Three-Dimensional Ordered TiO2 Films Fabricated by the Template Method
Wang Tao;Chen Yang;Chen Zhigang;School of Materials Science and Engineering;Jiangsu University;School of Materials Science and Engineering;Changzhou University;Jiangsu Key Laboratory for Environment Functional Materials;Suzhou University of Science and Technology;School of Chemistry Biology and Material Engineering;Suzhou University of Science and Technology;
..............page:359-365
Effect of the Metallic Compositions on the Properties of the CZTS Thin Films Prepared by Solid-State Sulfurization
Cao Zhongming;Yang Yuanzheng;Xu Jiaxiong;Xie Zhiwei;School of Materials and Energy;Guangdong University of Technology;
..............page:366-370+389
Design and Manipulation of the Bacteria Separation Electrode Based on the Travelling-Wave Dielectrophoresis
Feng Qiliang;Lian Kun;Tang Xiaoliang;Sang Shengbo;Key Lab of Advanced Transducers and Intelligent Control System;Micro and Nano System Research Center;College of Information Engineering;Taiyuan University of Technology;Center for Advanced Microstructures and Devices;Louisiana State University;
..............page:371-376
Thermal Analysis of the Low-Power Consumption Physics Package for a Chip-Scale Atomic Clock
Zhu Qifa;Han Jun;Wang Yiqun;Zhang Baoshun;Guo Lijian;School of Electronic Information and Control Engineering;Beijing University of Technology;Nano Processing Platform;Suzhou Institute of Nano-Tech and Nano-Bionics;Chinese Academy of Sciences;
..............page:377-383+401
A Method of Calculating the Changing Rate of the Silicon Piezoresistance Based on SOI Films
Li Dandan;Liang Ting;Li Sainan;Yao Zong;Hong Yingping;Qi Lei;Yang Fan;Xiong Jijun;Science and Technology on Electronic Test and Measurement Laboratory;North University of China;Key Laboratory of Instrumentation Science and Dynamic Measurement of Ministry of Education;North University of China;
..............page:384-389
Study on Monolithic Integration Technique of 3-Axis Accelerometers Based on(111)Silicon Wafer
Zhao Yi;Wang Jiachou;Chen Fang;Li Xinxin;State Key Laboratory of Transducer Technology;Shanghai Institute of Microsystem and Information Technology;Chinese Academy of Sciences;
..............page:390-395
Carbon Supported Nano-Sized Lanthanum Oxide Catalyst Prepared by the Precipitation Method and Its Properties
Xue Yue;Li Xinmei;College of Mechanical Engineering;Xinjiang University;
..............page:396-401
Mechanical Thinning Process of the Wafer After the Si-Si Direct Bonding
Chen Chen;Yang Hongxing;He Yuandong;The 46th Research Institute;CETC;
..............page:402-405